IC693DNM200 GE Series 90-30 DeviceNet Module

GE IC693DNM200 Series 90-30 DeviceNet Master Module

GE IC693DNM200 Series 90-30 DeviceNet Master Module

Availability: 10 left in stock

The GE IC693DNM200, also cataloged as the IC693DNM200 DeviceNet Master Module, operates as a dedicated hardware component for fieldbus network...

SKU: IC693DNM200

Manufacturer: GE Fanuc
Product No.: IC693DNM200
Product Type: Communication Modules
Product Origin: USA
Payment:T/T, Western Union
Weight: 230g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

The GE IC693DNM200, also cataloged as the IC693DNM200 DeviceNet Master Module, operates as a dedicated hardware component for fieldbus network management and digital I/O execution within Series 90-30 and PACSystems RX3i platforms. The module manages up to 63 DeviceNet slave devices across 125K, 250K, and 500K Baud network speeds while controlling 32 local positive-logic outputs.

Hardware Specifications

Parameter	Specification
Model	IC693DNM200
Brand	GE Fanuc Emerson
Series	Series 90-30 / PACSystems RX3i
Product Type	Communication Modules
Network Supported	DeviceNet
Baud Rates	125K, 250K, and 500K Baud
Max Connected Slaves	Up to 63 DeviceNet slave devices
Max Slave Data Transfer	255 Input Bytes / 255 Output Bytes per slave
Total Master Data Capacity	3972 Input Bytes / 3972 Output Bytes
Connection Types	Poll, Strobe, Cyclic, and Change-of-State (COS)
Output Points	32 outputs (positive logic)
Rated Voltage	12 to 24 VDC
Output Current	0.5 A per point (4.0 A max per group; 3.0 A max per common pin)
Inrush Current	5.4 A for 10 ms
Response Time	0.5 ms maximum (ON / OFF)
ON-State Voltage Drop	0.3 VDC
Backplane Current Draw	450 mA at 5 VDC (typical)
Communication Ports	1 DeviceNet terminal block, 1 RS-232 9-pin D-shell service port
Operating Temp	0 to 60 deg C (32 to 140 deg F)
Storage Temp	-40 to 85 deg C (-40 to 185 deg F)
Dimensions	Single-slot module footprint
Weight	0.23 kg (0.50 lbs)
Origin	USA

Backplane Bus Interfacing and Deterministic Networks

The IC693DNM200 connects directly to the main rack backplane bus of Series 90-30 or PACSystems RX3i CPUs, utilizing high backplane bus communication velocity to process up to 3972 bytes of input and output data. Network synchronization across DeviceNet deterministic networks is sustained through configurable Poll, Strobe, Cyclic, or COS messaging triggers. The module supports simultaneous dual Master/Slave execution, Unconnected Message Manager (UCMM) protocols, and on-the-fly firmware upgrades via the front RS-232 service port, maintaining firmware flash compatibility across active system revisions.

Frequently Asked Questions

Q: Which backplane baseplate slots support the IC693DNM200 module?

A: The module can be installed in any available slot of a Series 90-30 or RX3i main rack except slots 0 and 1. It is not supported in remote or expansion baseplates.

Q: What are the maximum current limits for the 32 discrete output channels?

A: Output points deliver up to 0.5 A per point. However, total current must not exceed 4.0 A per 8-point output group, and current per group common pin must stay below 3.0 A.

Q: Does the IC693DNM200 support firmware updates in the field?

A: Yes, module firmware is upgradeable via the front panel 9-pin RS-232 female service port using standard configuration software.

Field Installation Guidelines

Remove primary power from the PLC rack and field power sources prior to inserting or removing the module.
Wear an ESD grounding wrist strap connected to an unpainted metal enclosure frame during module handling.
Seat the IC693DNM200 into an authorized slot of the main rack (excluding slots 0 and 1) until the chassis latches lock in place.
Wire the DeviceNet network cable to the dedicated DeviceNet terminal block, placing 120 Ohm termination resistors at both physical ends of the trunk cable.
Connect external 12 to 24 VDC positive logic power to the output terminals, ensuring total current draw per group common pin remains under 3.0 A.

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