The GE IC694MDL740, also cataloged as the IC694MDL740 Discrete Output Module, operates as a dedicated hardware component for 12/24 VDC positive logic switching within PACSystems RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL740 |
| Brand | GE Fanuc Emerson |
| Origin | USA / Global Manufacturing |
| Weight | 0.31 kg (0.69 lbs) |
| Dimensions | Single-Slot PACSystems RX3i Form Factor |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 110 mA from +5 VDC backplane bus (all outputs active) |
| Series | PACSystems RX3i |
| Product Type | Discrete Output Modules |
| Output Channels | 16 points (2 isolated groups of 8 points each) |
| Logic Type | Positive Logic (Sourcing) |
| Rated Output Voltage | 12/24 VDC (Operating Range: 10.2 to 28.8 VDC) |
| Output Current per Point | 0.5 A maximum |
| Output Current per Group | 2 A maximum per group |
| Peak Inrush Current | 4.78 A for 10 ms |
| Response Time | 2 ms maximum (ON and OFF) |
| ON-State Voltage Drop | 1.0 VDC maximum |
| OFF-State Leakage Current | 1.0 mA maximum |
| Field-to-Backplane Isolation | 250 VAC continuous; 1500 VAC for 1 minute |
| Group-to-Group Isolation | 250 VAC continuous; 1500 VAC for 1 minute |
| Status Indicators | 16 individual channel LEDs, 1 Fuse Blown status LED |
Backplane Bus Communication Velocity and System Integration
The IC694MDL740 exchanges output image table states directly across the PACSystems RX3i backplane rack interface. High-speed backplane bus communication velocity allows rapid execution cycles with a maximum channel response delay of 2 ms.
Firmware flash compatibility ensures seamless backplane integration across local RX3i universal chassis slots and remote expansion racks. Flexible I/O density scaling allows distribution of 16-channel sourcing blocks across local or distributed networks, enabling dual-group phase/voltage isolation when controlling solenoids, motor starters, and indicator arrays.
Frequently Asked Questions
Q: What is the backplane current load imposed by the IC694MDL740?
A: The module draws a maximum of 110 mA from the internal +5 VDC backplane power bus when all 16 output channels are in an active state.
Q: What level of electrical isolation is provided between output groups and the frame ground?
A: Optical isolation provides 250 VAC continuous isolation (1500 VAC for 1 minute) between channel groups, field-to-backplane logic, and frame ground.
Q: Can the IC694MDL740 handle high inrush currents from inductive field loads?
A: Yes, each output point supports a peak inrush current rating of 4.78 A for up to 10 ms.
Field Installation Guidelines
- Verify that the main chassis backplane power supply and external field DC voltage sources are de-energized prior to installing or removing the module.
- Secure all external 12/24 VDC wiring to the removable terminal block using proper wire gauges to ensure tight screw-terminal torque.
- Ensure external load currents do not exceed the limits of 0.5 A per channel and 2 A total per 8-channel isolated group.
- Maintain clear panel ventilation pathways to facilitate adequate convection cooling across the RX3i rack assembly.
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