The GE IC697CHS791, also cataloged as the IC697CHS791 Module Rack, operates as a dedicated hardware component for physical mounting and backplane bus integration within Series 90-70 platforms. It houses power supplies, central processing units, and input/output modules, facilitating electrical connections across the backplane bus.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC697CHS791 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 4.39 kg (9.69 lbs) |
| Dimensions | Standard 19-inch rack layout with 9 Slots |
| Operating Temp | 0 to 40 deg C |
| Storage Temp | 0 to 50 deg C |
| Power Supply Support | AC and DC modules |
| I/O Bus Current Requirement | 0.5 Amps |
| Relative Humidity | 80% maximum, non-condensing |
| Operating Altitude | 1000 meters maximum above sea level |
Backplane Integration and I/O Density Scaling
The physical architecture of the IC697CHS791 supports physical I/O density scaling by providing 9 slots to hold processing, communication, and interface modules. The internal backplane bus requires a baseline current of 0.5 Amps to sustain routing logic. Bus traffic behaves deterministically across all slots without requiring external backplane bus communication velocity Licences. Fully integrated mechanical keying prevents module misalignment during insertion, securing physical electrical pin connections under physical operating vibrations.
Frequently Asked Questions
Q: Does the IC697CHS791 chassis require an active cooling fan assembly?
A: No. An active cooling fan is not required for installation and standard operation, provided surrounding air convection allows heat dissipation within the rated operating temperature limit of 0 to 40 deg C.
Q: Can both AC and DC power supplies be mounted in this rack?
A: Yes. The rack infrastructure is engineered to support both AC and DC power supply modules to distribute power across the backplane bus.
Q: Does this rack support physical keying to prevent wrong module installation?
A: Yes. Mechanical keying is fully supported to ensure modules can only be inserted into slot allocations that match their electrical key profiles.
Field Installation Guidelines
- Mounting Alignment: Secure the module rack using front mounting fasteners on a standard 19-inch rack frame.
- Grounding Requirements: Ensure the metal chassis of the rack is connected to the primary protective earth ground of the enclosure prior to mounting any active CPU or power modules.
- Ambient Airflow Clearance: Maintain adequate clearance spacing above and below the rack to prevent temperatures from exceeding the 40 deg C maximum limit.
- Module Keying Setup: Adjust the mechanical keys on each slot to correspond to the specified module assignment before pushing modules into the backplane connectors.
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