The GE Fanuc IC695CHS007, also cataloged as the IC695CHS007 Universal Backplane, operates as a dedicated hardware component for high-speed module interconnection and internal power routing within PACSystem RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CHS007 |
| Brand | GE Fanuc / Emerson |
| Origin | USA / As specified on hardware label |
| Weight | 2.31 lbs (1.05 kg) |
| Dimensions | Standard 7-slot RX3i chassis frame width |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Internal draw: 240 mA @ 5 VDC, 600 mA @ 3.3 VDC |
| Slot Count | 7 slots (Slot 0 for CPU/Power Supply; Slots 1-5 for RX3i/Series 90-30 I/O; Slot 6 for RX3i I/O) |
| Internal Bus Architecture | High-speed PCI Bus / Serial Bus dual architecture |
| Auxiliary Terminal Strip (TB1) | Terminal 7: Isolated +24 VDC; Terminal 8: Isolated ground |
| Recommended Wiring | 14 to 22 AWG copper wire for power/ground connections |
| Mounting Orientation | Horizontal panel mount |
| Required Enclosure / Clearance | IP20 / NEMA Type 1 enclosure (IP54 or greater enclosure recommended); 102 mm (4.0 in) clearance on all sides |
| Hot-Swap Support | Module removal and insertion under power supported |
Backplane Bus Communication Velocity and Deterministic Networks
The IC695CHS007 combines dual high-speed PCI bus and serial bus traces to maximize backplane bus communication velocity across all 7 module slots. The backplane supports both RX3i and legacy Series 90-30 I/O modules simultaneously, providing deterministic data exchange for processing units and communication interfaces. Internal power rails deliver 3.3 VDC and 5 VDC logic current alongside an isolated +24 VDC auxiliary terminal block to prevent field-induced ground loops.
Frequently Asked Questions
Q: What are the slot assignment restrictions on the IC695CHS007 7-slot universal backplane?
A: Slot 0 is dedicated to the IC695 Power Supply or CPU module. Slots 1 through 5 accept both RX3i and Series 90-30 option/I/O modules, while Slot 6 accepts RX3i option and I/O modules exclusively.
Q: Is hot-swapping supported for I/O modules installed in the IC695CHS007 backplane?
A: Yes, the IC695CHS007 architecture supports module hot-swap (removal and insertion under power) for compatible I/O modules.
Field Installation Guidelines
- Mount the chassis horizontally on a flat metallic panel using standard mounting hardware, ensuring an IP20/NEMA Type 1 or higher (e.g., IP54) enclosure rating.
- Maintain a minimum clearance of 102 mm (4.0 in) on all four sides of the backplane to allow adequate heat dissipation and cable routing access.
- Connect isolated +24 VDC external power and ground to terminal block TB1 (Terminals 7 and 8) using 14 to 22 AWG copper wire.
- Verify internal ground bar connection to cabinet ground before inserting power supply and I/O modules into their designated slots.
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