MS08*B Yokogawa CENTUM VP Series Datasheet & Technical Manual

MS08*B Yokogawa S9763BH-05 Power Supply Card

MS08*B Yokogawa S9763BH-05 Power Supply Card

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Yokogawa MS08*B System Power Supply Module Configured for converting incoming DC power into regulated outputs in CENTUM VP and CS...

رمز المنتج: MS08*B

Manufacturer: Yokogawa
Product No.: MS08*B
Product Type: Power Supply Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 350g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Yokogawa MS08*B System Power Supply Module

Configured for converting incoming DC power into regulated outputs in CENTUM VP and CS 3000 networks, the Yokogawa MS08*B (MS08 System Power Supply Module) provides direct physical/electrical execution. The hardware installs into the Field Control Unit (FCU) subrack to drive high-density internal backplane logic and deliver stabilized operating current to associated processing cards.

Hardware Specifications

Parameter	Specification
Model	MS08*B (Part Number: S9763BH-05)
Brand	Yokogawa
Origin	Japan
Weight	0.35 kg
Dimensions	120 mm x 25 mm x 130 mm
Operating Temp	0 to 60 deg C
Power Consumption	40 W
System Compatibility	CENTUM VP, CS 3000
Input Voltage	24 VDC (nominal)
Input Range	20 to 30 VDC
Output Voltage	5 VDC
Output Current	Up to 8 A
Isolation	1500 VAC (input-to-output, 1 min)
Protection Features	Overcurrent, overvoltage, short-circuit protection
Humidity Range	5 to 95% RH (non-condensing)

Power Conditioning & Channel Isolation

The processing module accepts a nominal 24 VDC input and utilizes internal high-current switching circuits to deliver a regulated 5 VDC output supplying up to 8 A. To prevent common-mode electrical noise and high-voltage transients from compromising downstream computing circuits, the hardware establishes a galvanic isolation barrier rated at 1500 VAC between the field input terminals and system logic networks. Integrated protection circuits continuously monitor for overcurrent, overvoltage, and short-circuit conditions, automatically clamping the electrical paths to safeguard backplane components during an active fault state. Continuous hardware diagnostics are routed to front-panel LED indicators displaying discrete statuses for RUN, FAIL, and input power tracking.

Frequently Asked Questions

Q: How does the higher current capacity of the MS08B impact chassis slot allocation inside the FCU backplane? A: The MS08B provides an elevated 8 A current rating compared to lower-capacity modules. It seats directly into the standardized power supply slots of compatible CENTUM VP subracks, supplying the higher power densities required by large-scale or fully populated I/O card arrangements without altering the physical slot architecture.

Q: What action does the internal protection circuit take if a sustained short-circuit occurs on the 5 VDC logic bus?

A: The internal short-circuit protection array activates immediately to clamp the output current, protecting the internal components from thermal damage. Once the external short-circuit fault condition is physically isolated and resolved, the module automatically resets its output voltage parameters to the nominal 5 VDC operating level.

Field Installation Guidelines

Subrack Alignment and Seating: Guide the card along the designated chassis slot tracks within the FCU subrack. Push the assembly firmly perpendicular to the backplane until the high-density system connector locks completely, and tighten all mechanical retention fasteners to prevent intermittent contact from ambient vibration.
Input Power Conductor Routing: Terminate the incoming 24 VDC supply conductors using designated industrial terminal blocks. Maintain independent physical routing separation between these DC supply cables and any high-voltage AC power or motor drive cables within the cabinet enclosure to minimize electromagnetic interference.
Thermal Management Clearance: Verify that all ambient cooling pathways within the enclosure remain unblocked. The card requires adequate convective air displacement to operate within its designated 0 to 60 deg C threshold, preventing localized heat accumulation under high 8 A load currents.

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