TSXP571634M Schneider Electric Modicon Premium Processor

Schneider Electric TSXP571634M Modicon Premium Unity PL7 Controller

Schneider Electric TSXP571634M Modicon Premium Unity PL7 Controller

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Schneider Electric TSXP571634M Modicon Premium Unity Processor The Schneider Electric TSXP571634M, also cataloged as the TSXP571634M PL7 processor module, operates...

رمز المنتج: TSXP571634M

Manufacturer: Schneider
Product No.: TSXP571634M
Product Type: CPU Processors
Product Origin: France
Payment:T/T, Western Union
Weight: 520g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Schneider Electric TSXP571634M Modicon Premium Unity Processor

The Schneider Electric TSXP571634M, also cataloged as the TSXP571634M PL7 processor module, operates as a dedicated hardware component for discrete, analog, and multi-task control execution within Modicon Premium PLC platform networks. The hardware establishes physical logic resolution and coordinates communication routing across localized backplane chassis structures.

Hardware Specifications

Parameter	Specification
Model	TSXP571634M
Brand	Schneider Electric
Origin	France
Weight	0.52 kg (1.15 lbs)
Dimensions	Double-format Premium module slot configuration
Operating Temp	0 to 60 deg C
Power Consumption	8.25 W (1650 mA @ 5 VDC) maximum
Discrete I/O Capacity	Up to 1024 discrete I/O (matrix configuration dependent)
Analog I/O Capacity	Up to 128 analog I/O
Instruction Execution Time	0.12 us Boolean minimum, 0.19 us Boolean standard
Application Structure	1 master task, 1 fast task, up to 64 event tasks
Internal RAM Storage	96 KB data (expandable via PCMCIA memory cards)
Integrated Interfaces	1 x Ethernet TCP/IP RJ45, 2 x Female Mini-DIN RS485 (19.2 kbit/s)
Network Module Capacity	Up to 2 communication expansion modules
Maximum Rack Scaling	Up to 4 racks total (chassis configurations up to 12 slots)
Enclosure Protection	IP20, pollution degree 2

Deterministic Backplane and Firmware Processing

The hardware utilizes a high-velocity processing architecture to sustain deterministic backplane bus communication velocity across multi-rack topologies. The unit implements firmware flash compatibility to synchronize execution cycles with remote networks including Profinet / EtherNet/IP deterministic networks, CANopen, and Modbus sub-buses. Application structural scheduling maintains a 1 ms master task and 0.3 ms fast task system overhead constraint, stabilizing execution loops during peak I/O density scaling routines.

Frequently Asked Questions

Q: How does the presence of an auxiliary PCMCIA memory card affect Boolean instruction execution performance?

A: Internal RAM execution without an auxiliary card delivers a Boolean speed of 0.19 us per instruction, yielding 3.71 Kinst/ms. Inserting a PCMCIA card shifts execution timing to 0.25 us per Boolean instruction, resolving at 2.1 Kinst/ms due to the memory bus arbitration overhead.

Q: What are the internal power consumption loading limits imposed on the rack power supply by this processor?

A: The processor draws a nominal current of 1000 mA to a maximum of 1650 mA entirely from the 5 VDC backplane power rail. System engineers must include this value in the total chassis power budget when sizing the local rack power supply module.

Q: What specific action occurs to the task execution memory map when an I/O fault condition is encountered?

A: The processor maps the hardware failure to native diagnostic system bits. The red I/O fault LED illuminates immediately, and the internal application structure evaluates the severity via the master task logic to determine whether to execute a fail-safe halt or carry out user-defined fault routine blocks.

Field Installation Guidelines

Mount the double-format processor module into the dedicated slots of a Modicon Premium rack assembly, ensuring the grounding clips seat firmly onto the metal backplane chassis plate. Tighten the module retaining screws to prevent intermittent connection failures resulting from physical vibration. Maintain unhindered vertical clearances above and below the rack assembly to allow ambient airflow currents to pass through the housing slots, preserving the 0 to 60 deg C operational boundary.

All serial communication connections attached to the mini-DIN ports must use shielded, twisted-pair cables with proper strain relief. Ground the Ethernet cable shields exclusively at the switch bulkhead panel. Route all low-voltage signal lines away from three-phase power lines, motor starters, and high-frequency inverter outputs to limit inductive interference on the internal data bus lines.

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