NFAI841-S00 Yokogawa FIO Series Datasheet & Technical Manual

Yokogawa NFAI841-S00 STARDOM FIO Analog I/O Module

Yokogawa NFAI841-S00 STARDOM FIO Analog I/O Module

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Yokogawa NFAI841-S00 Analog I/O Module The Yokogawa NFAI841-S00, also cataloged as the NFAI841 Analog I/O Module, operates as a dedicated...

رمز المنتج: NFAI841-S00

Manufacturer: Yokogawa
Product No.: NFAI841-S00
Product Type: Analog Input Output Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 0g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Yokogawa NFAI841-S00 Analog I/O Module

The Yokogawa NFAI841-S00, also cataloged as the NFAI841 Analog I/O Module, operates as a dedicated hardware component for simultaneous 4-20 mA DC input and output signal processing within CENTUM VP and STARDOM control platforms.

Suffix Breakdown & Model Matrix

NFAI841: Analog I/O Module (4 to 20 mA, 8-channel input / 8-channel output)
-S: Standard hardware type
0: Basic type with no intrinsic explosion protection
0: Basic type with standard conformal coating (Style S2)

Hardware Specifications

Parameter	Specification
Model	NFAI841-S00
Brand	Yokogawa
Origin	Japan
Weight	0.20 kg (0.44 lbs)
Dimensions	Standard FIO single-slot width (2.2 x 12.4 x 12.6 cm)
Operating Temp	-20 deg C to +70 deg C
Power Consumption	230 mA (5 V DC), 540 mA (24 V DC)
Input Channels	8 channels, non-isolated, 4-20 mA DC
Output Channels	8 channels, non-isolated, 4-20 mA DC
Accuracy	+/- 16 uA
Temperature Drift	+/- 16 uA per 10 deg C
Data Update Period	10 ms
Isolation	1500 V AC between I/O channels and system backplane (1 min)
Environmental Rating	ISA G3 corrosion resistance

DCS Process Control & Instrumentation Attributes

The NFAI841-S00 manages 8 analog inputs and 8 analog outputs on a shared negative return path, operating as a high-density, non-isolated field interface. The device is designed to process standard 4-20 mA HART loops, allowing simultaneous transmission of the analog process variable and digital diagnostics. While channel-to-channel isolation is not implemented within this specific card design, the complete I/O loop circuitry is decoupled from the active system bus via a 1500 V AC galvanic isolation barrier. This baseline prevents ground loop noise on the plant floor from corrupting the central processor backplane.

Frequently Asked Questions

Q: How must the power loops be wired considering the non-isolated channel architecture?

A: Because the 8 input and 8 output channels share a common internal return line, all field devices connected to this module must operate on the same reference potential. Avoid coupling loops with disparate power supply systems to prevent parallel ground currents.

Q: Does the module support online hot-swap procedures in redundant schemes?

A: Yes. When configured in dual-redundant pairing within the FIO node, a faulty module can be removed and replaced under power without dropping the active 4-20 mA output signals or interrupting the system scan.

Q: What are the installation limits regarding hazardous gas zones?

A: The "00" suffix combination specifies a module with no built-in explosion protection. Consequently, any connections running to transmitters in Zone 1 or Zone 2 atmospheres must interface with external, DIN-rail mounted intrinsic safety barriers.

Field Installation Guidelines

Chassis Slot Mounting: Slide the Style S2 module into the allocated slot of the FIO node base plate. Push firmly until the lock tabs snap into place to verify a low-resistance connection to the backplane.
Terminal Board Connections: Connect field cabling directly via the specified pressure clamp terminal blocks. Ensure all screws are properly torqued to prevent terminal resistance buildup on the loop.
Grounding Requirements: Terminate all transmitter signal shields at a single point on the designated cabinet instrument ground bar. Avoid multiple grounding points to maintain the 1500 V AC isolation barrier.
Thermal Management: Provide continuous ventilation inside the enclosure. When operating close to the +70 deg C limit, ensure adjacent slots remain vacant or utilize forced air cooling to minimize the potential for thermal drift.

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