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The GE Fanuc IC697CHS750, also cataloged as the IC697CHS750 I/O Rack, operates as a dedicated hardware component for module interconnectivity and backplane bus signal distribution within GE Series 90-70 PLC systems.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC697CHS750 |
| Brand | GE Fanuc Emerson |
| Origin | USA |
| Weight | 8.88 lbs (4.03 kg) |
| Dimensions | 11.15 in (H) x 12.60 in (W) x 7.50 in (D) [254 mm deep enclosure] |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Not specified (Passive backplane structure) |
| Rated Current | 20 Amperes |
| Supply Voltage | 5 VDC |
| Slot Capacity | 5 slots |
| Enclosure Rating | Open Enclosure, indoor use only |
| Cooling Type | Convection airflow cooling |
| Mounting Type | Rear mount mechanism |
| Series Compatibility | GE Series 90-70 / IC697 PLC series |
Backplane Bus Communication Velocity & I/O Density Scaling
The IC697CHS750 rack provides the physical housing and electrical backplane connectivity required for 5-slot Series 90-70 module configurations. Designed to maintain deterministic communication velocity across the backplane bus, the chassis structure routes high-speed data signals between processing units and expansion cards. The internal backplane power distribution supports up to 20 Amperes at 5 VDC to ensure stable voltage delivery across all populated slots. Firmware flash compatibility and noise-immune signaling are maintained across module backplane traces through dedicated grounding measures and rigid physical card guides.
Frequently Asked Questions
Q: How is power provided to individual modules installed in the IC697CHS750 chassis?
A: Modules populated within the 5 slots receive power via the internal backplane connector or through dedicated individual power supplies positioned on the left side of the module location.
Q: What physical clearance is required to maintain proper thermal dissipation for the rack?
A: The open enclosure relies on natural convection cooling. Unobstructed airflow pathways must be maintained between the chassis top/bottom ventilation spaces and nearby enclosure air outlets to prevent heat accumulation.
Q: How are field wiring connections secured to prevent mechanical strain on the backplane?
A: Field wiring passes through the bottom of the hinged door to access the removable terminal block, and an I/O terminal restraining strap on the side of the rack holds cables firmly in position.
Field Installation Guidelines
- Mount the IC697CHS750 chassis securely to a flat panel or enclosure backplate using the rear mounting holes. Ensure the mounting location is indoors and protected from environmental contaminants.
- Establish a low-impedance functional earth connection from the rack chassis ground point to the main panel ground bus to eliminate electrical noise interference.
- Align card modules carefully with the top and bottom slot guides before sliding them firmly into the backplane connectors.
- Route field wiring upward through the bottom opening of the hinged door. Secure all cable bundles using the side terminal restraining strap to prevent strain on the terminal connections.
- Verify that backplane J2 jumpers, if required by the system topology, are properly installed according to the Series 90-70 system expansion manual prior to applying primary power.
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