IC695CHS012 GE Fanuc RX3i Universal Backplane

GE Fanuc IC695CHS012 PACSystems RX3i 12-Slot Universal Backplane

GE Fanuc IC695CHS012 PACSystems RX3i 12-Slot Universal Backplane

Disponibilidad: 10 Quedan en stock

The GE Fanuc IC695CHS012, also cataloged as the IC695CHS012 Universal Backplane, operates as a dedicated hardware component for multi-bus signal...

Código: IC695CHS012

Manufacturer: GE Fanuc
Product No.: IC695CHS012
Product Type: Universal Backplanes
Product Origin: USA
Payment:T/T, Western Union
Weight: 1810g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

The GE Fanuc IC695CHS012, also cataloged as the IC695CHS012 Universal Backplane, operates as a dedicated hardware component for multi-bus signal routing and module power distribution within PACSystems RX3i control platforms.

Hardware Specifications

Parameter	Specification
Model	IC695CHS012
Brand	GE Fanuc / Emerson
Product Line	PACSystems RX3i
Product Type	Universal Backplane
Number of Slots	12 Slots
Bus Architecture	Dual-Bus (PCI Bus & Serial Bus)
Module Compatibility	RX3i PCI, RX3i Serial, Series 90-30 I/O Modules
Power Supply Support	AC and DC Power Supplies
Max Current @ 3.3 VDC	600 mA (1.98 W)
Max Current @ 5 VDC	240 mA (1.20 W)
Total Heat Dissipation	3.18 W
Hot Swap Capability	Supported for standard I/O modules (Excludes CPU)
Expansion Support	I/O expansion cables & remote backplane cables
Terminator Requirement	External terminating resistor for remote connections
Weight	4.00 lbs (1.81 kg)
Operating Temperature	0 to 60 deg C

Backplane Bus Architecture and I/O Density Scaling

The IC695CHS012 utilizes a high-velocity dual-bus backplane architecture combining a PCI bus for high-speed RX3i modules and a serial bus for backward compatibility with Series 90-30 I/O components. This dual-structure permits dynamic scaling of I/O density across mixed-generation control topologies without requiring bus translation gateways. Expansion interface connectors allow direct interconnection with remote backplane racks using dedicated expansion cabling. Signal integrity over extended expansion distances requires a dedicated external terminating resistor attached to the final rack endpoint.

Frequently Asked Questions

Q: Can the CPU module be replaced while the backplane power remains active?

A: No. While standard PCI, serial, and Series 90-30 I/O modules support hot-swapping (hot module insertion and removal) during operational runtime, CPU modules must be powered off before removal to prevent backplane bus arbitration errors.

Q: What are the internal current load limits imposed by the backplane logic circuitry?

A: The backplane onboard logic draws a maximum current of 600 mA at 3.3 VDC (1.98 W) and 240 mA at 5 VDC (1.20 W). System designers must ensure combined I/O module consumption remains within power supply output thresholds.

Field Installation Guidelines

Mount the backplane securely on a flat vertical panel or standard DIN rail structure, maintaining a minimum vertical clearance of 100 mm above and below the chassis for ambient thermal convection.
Connect the backplane grounding terminal directly to the central panel earth ground point using copper conductor wire with a minimum gauge of 14 AWG (2.08 mm sq) to minimize EMI susceptibility.
Ensure that remote backplane expansion cables are equipped with an external terminating resistor plugged into the end rack to prevent high-frequency bus signal reflections.
Observe proper insertion alignment when seating 90-30 or RX3i modules into slots 1 through 12 to avoid physical pin deformation on the backplane connector header.

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