IC695CHS007 GE Fanuc Universal Backplane

IC695CHS007 GE Fanuc PACSystem RX3i Universal Backplane

IC695CHS007 GE Fanuc PACSystem RX3i Universal Backplane

Disponibilidad: 10 Quedan en stock

The GE Fanuc IC695CHS007, also cataloged as the IC695CHS007 Universal Backplane, operates as a dedicated hardware component for high-speed module...

Código: IC695CHS007

Manufacturer: GE Fanuc
Product No.: IC695CHS007
Product Type: Baseplates
Product Origin: USA
Payment:T/T, Western Union
Weight: 1050g
Shipping port: Xiamen
Warranty: 12 months

Descripción Reseñas

The GE Fanuc IC695CHS007, also cataloged as the IC695CHS007 Universal Backplane, operates as a dedicated hardware component for high-speed module interconnection and internal power routing within PACSystem RX3i platforms.

Hardware Specifications

Parameter	Specification
Model	IC695CHS007
Brand	GE Fanuc / Emerson
Origin	USA / As specified on hardware label
Weight	2.31 lbs (1.05 kg)
Dimensions	Standard 7-slot RX3i chassis frame width
Operating Temp	0 to 60 deg C
Power Consumption	Internal draw: 240 mA @ 5 VDC, 600 mA @ 3.3 VDC
Slot Count	7 slots (Slot 0 for CPU/Power Supply; Slots 1-5 for RX3i/Series 90-30 I/O; Slot 6 for RX3i I/O)
Internal Bus Architecture	High-speed PCI Bus / Serial Bus dual architecture
Auxiliary Terminal Strip (TB1)	Terminal 7: Isolated +24 VDC; Terminal 8: Isolated ground
Recommended Wiring	14 to 22 AWG copper wire for power/ground connections
Mounting Orientation	Horizontal panel mount
Required Enclosure / Clearance	IP20 / NEMA Type 1 enclosure (IP54 or greater enclosure recommended); 102 mm (4.0 in) clearance on all sides
Hot-Swap Support	Module removal and insertion under power supported

Backplane Bus Communication Velocity and Deterministic Networks

The IC695CHS007 combines dual high-speed PCI bus and serial bus traces to maximize backplane bus communication velocity across all 7 module slots. The backplane supports both RX3i and legacy Series 90-30 I/O modules simultaneously, providing deterministic data exchange for processing units and communication interfaces. Internal power rails deliver 3.3 VDC and 5 VDC logic current alongside an isolated +24 VDC auxiliary terminal block to prevent field-induced ground loops.

Frequently Asked Questions

Q: What are the slot assignment restrictions on the IC695CHS007 7-slot universal backplane?

A: Slot 0 is dedicated to the IC695 Power Supply or CPU module. Slots 1 through 5 accept both RX3i and Series 90-30 option/I/O modules, while Slot 6 accepts RX3i option and I/O modules exclusively.

Q: Is hot-swapping supported for I/O modules installed in the IC695CHS007 backplane?

A: Yes, the IC695CHS007 architecture supports module hot-swap (removal and insertion under power) for compatible I/O modules.

Field Installation Guidelines

Mount the chassis horizontally on a flat metallic panel using standard mounting hardware, ensuring an IP20/NEMA Type 1 or higher (e.g., IP54) enclosure rating.
Maintain a minimum clearance of 102 mm (4.0 in) on all four sides of the backplane to allow adequate heat dissipation and cable routing access.
Connect isolated +24 VDC external power and ground to terminal block TB1 (Terminals 7 and 8) using 14 to 22 AWG copper wire.
Verify internal ground bar connection to cabinet ground before inserting power supply and I/O modules into their designated slots.

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