BMXXBP0600 Schneider Backplane Module

BMXXBP0600 Schneider Modicon X80 6-Slot Backplane

BMXXBP0600 Schneider Modicon X80 6-Slot Backplane

Availability: 94 left in stock

Schneider BMXXBP0600 Modicon X80 Backplane Configured for high-density physical module housing in Modicon X80 automation networks, the Schneider BMXXBP0600 (BMXXBP0600...

SKU: BMXXBP0600

Manufacturer: Schneider
Product No.: BMXXBP0600
Product Type: Backplane Racks
Product Origin: France
Payment:T/T, Western Union
Weight: 790g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Schneider BMXXBP0600 Modicon X80 Backplane

Configured for high-density physical module housing in Modicon X80 automation networks, the Schneider BMXXBP0600 (BMXXBP0600 Backplane) provides direct physical/electrical execution. This 6-slot rack establishes the electrical and mechanical backbone required to link a central processing unit, power supply, and standard I/O modules across the common bus architecture, enabling synchronized communication and internal power distribution without discrete wiring harnesses.

Hardware Specifications

Parameter	Specification
Model	BMXXBP0600
Brand	Schneider Electric
Origin	US
Weight	0.79 kg (1.74 lb)
Dimensions	307.6 x 103.7 x 19 mm (12.1 x 4.08 x 0.7 in)
Operating Temp	0 to 60 deg C (32 to 140 deg F)
Power Consumption	1.68 W internal power demand
Slots	6 Bus X slots
Product Compatibility	BMXP34 processor, BMXCPS power supply, I/O modules, Specific application modules
Electrical Connection	1 connector for XBE expansion module
Fixing Mode	4 M4/M5/M6 screws (panel/mounting plate) or 35 mm symmetrical DIN rail clips
IP Degree of Protection	IP20
Relative Humidity	10 to 95 % non-condensing
Directives	2014/35/EU (Low Voltage), 2014/30/EU (EMC)
Certifications	CE, UL, CSA, RCM, EAC, UKCA, Merchant Navy
Standards	EN/IEC 61131-2, EN/IEC 61010-2-201, EN/IEC 61000-6-5, EN/IEC 61850-3

Backplane Bus Communication Velocity and Compatibility

The Schneider BMXXBP0600 utilizes an integrated Bus X backplane architecture to sustain high-velocity backplane bus communication across all 6 slots. System configuration relies on firmware flash compatibility between the installed BMXP34 or M580 processors and corresponding digital or analog I/O modules. The physical backplane trace routing isolates the 1.68 W internal control power logic from high-frequency signal noise, preventing cross-channel interference during intensive I/O density scaling. Multi-rack expansion is achieved by interfacing a dedicated BMXXBE1000 extension module via the integrated XBE connector, maintaining deterministic bus timings across expanded configurations.

Frequently Asked Questions

Q: Can the BMXXBP0600 backplane be expanded to support more than 6 modules if system requirements change?

A: Yes. While the physical chassis is limited to 6 slots, engineers can achieve multi-rack expansion by installing a BMXXBE1000 extension module into the dedicated backplane connector, linking additional X80 racks.

Q: What are the grounding requirements for the backplane to ensure EMC compliance?

A: The backplane must be mounted using the designated 4 M4/M5/M6 screw points to an unpainted, conductive mounting plate, or secured via the integrated clips to a grounded 35 mm symmetrical DIN rail to satisfy EN/IEC 61000-6-5 standards.

Field Installation Guidelines

Mounting Orientation and Mechanics: Install the backplane vertically inside an IP20-rated or higher industrial enclosure. Fix the unit securely using 4 M4, M5, or M6 screws through the pre-drilled panel mounting points or snap the rear clips onto a standard 35 mm symmetrical DIN rail.
Module Seating: Insert the power supply module, processor, and I/O components into their respective slots, verifying that the rear connectors engage smoothly with the backplane bus pins. Fasten the individual module retention screws to ensure continuous electrical contact and resistance to vibration.
Thermal Management: Maintain an open clearance boundary around the rack to accommodate an operating temperature range of 0 to 60 deg C. Do not obstruct the ventilation pathways of the modules seated on the backplane.
Shielding and Grounding: Ensure the enclosure sub-panel has a low-impedance connection to the main functional earth (FE) busbar. All shielded field wiring cables connected to modules housed within the backplane must be grounded at the panel entry point.

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