Yokogawa MAC2*A CENTUM VP Multipoint Analog Control Card

Availability: 10 left in stock

Yokogawa MAC2*A Multipoint Analog Control Card Configured for high-speed network integration in industrial automation environments, the Yokogawa MAC2*A, also cataloged...

SKU: MAC2*A

Manufacturer: Yokogawa
Product No.: MAC2*A
Product Type: Communication Processor Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 350g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Yokogawa MAC2*A Multipoint Analog Control Card

Configured for high-speed network integration in industrial automation environments, the Yokogawa MAC2*A, also cataloged as the MAC2-A Multipoint Analog Control Card, provides direct physical/electrical execution to manage multiple analog loops and process variable arbitration. The hardware functions as a dedicated interface module between field control units and the Vnet/IP network layer, executing deterministic signal translation and bus synchronization directly via the system backplane.

Hardware Specifications

Parameter	Specification
Model	MAC2*A
Brand	Yokogawa
Origin	Japan
Weight	0.35 kg (1.53 lbs)
Dimensions	120 mm x 25 mm x 130 mm
Operating Temp	0 to 60 deg C
Power Consumption	~6.0 W (calculated from 5 VDC, ~1.2 A)
Card Type	Communication Processor / Multipoint Analog Control
Communication Protocol	Vnet/IP (100 Mbps Ethernet-based)
System Compatibility	CENTUM VP, CS 3000 systems
Electrical Isolation	1500 VAC (system-to-bus, 1 min)
Diagnostics	Dedicated LED indicators for link, activity, and fault
Humidity Range	5 to 95% RH (non-condensing)

Distributed Process Control & System Bus Performance

The control card executes dedicated multipoint signal routing and analog loop oversight across the high-speed Vnet/IP infrastructure. To prevent transient field spikes and localized electromagnetic disturbances from compromising the main system processors, the hardware maintains a continuous 1500 VAC galvanic isolation barrier between the system logic and the network bus. The onboard microprocessor manages frame encoding and cyclic transmission schedules at a deterministic 100 Mbps data rate. This native network synchronization prevents processing delays when transferring analog process variables, such as temperature, pressure, and flow commands, from the field control station down to physical output blocks.

Frequently Asked Questions

Q: How does the hardware maintain continuous data flow if a single Vnet/IP network link fails?

A: The card incorporates native hardware support for dual-redundant deployment topologies. When two identical cards occupy paired slots, they perform continuous background parameter mirrors, executing an automatic bumpless switchover to the secondary card if the primary processing channel registers a link drop or firmware exception.

Q: What specific functional risks are present when inserting or removing the card under power?

A: Hot-swapping is physically supported by the backplane connectors but must be executed only when a secondary redundant module is actively tracking the loop parameters. If a non-redundancy paired card undergoes online removal, all open analog control loops managed by that processor will stall, causing the associated system blocks to default to their pre-configured fault positions.

Field Installation Guidelines

Chassis Insertion Alignment: Insert the card vertically along the structural guide rails of the designated field control unit chassis slot. Push the assembly into the terminal interface block until the plastic locking clips snap into place, establishing low-resistance surface contact across the system backplane connectors.
Shield Grounding Regimen: Terminate all industrial Ethernet or system bus cable shields at the dedicated common chassis ground strip inside the control enclosure. Avoid creating multi-point ground loops by checking that signal wire shielding is ungrounded at potential floating device terminals.
Thermal Duct Clearance: Maintain unhindered vertical pathways through the ventilation grilles located above and below the card chassis bank. Verify that high-density wiring bundles do not block cross-flowing cabinet air currents, keeping the local temperature surrounding the board between 0 and 60 deg C.

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