IC200MDL930 GE Fanuc VersaMax Datasheet & Technical Manual

IC200MDL930 GE Fanuc VersaMax Relay Output Module

IC200MDL930 GE Fanuc VersaMax Relay Output Module

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The GE Fanuc IC200MDL930, also cataloged as the IC200MDL930 Relay Output Module, operates as a dedicated hardware component for isolated...

SKU: IC200MDL930

Manufacturer: GE Fanuc
Product No.: IC200MDL930
Product Type: Digital I/O Cards
Product Origin: USA
Payment:T/T, Western Union
Weight: 910g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

The GE Fanuc IC200MDL930, also cataloged as the IC200MDL930 Relay Output Module, operates as a dedicated hardware component for isolated discrete switching within VersaMax I/O platforms.

Hardware Specifications

Parameter	Specification
Model	IC200MDL930
Brand	GE Fanuc Emerson
Origin	USA / Various
Weight	0.26 kg (0.56 lbs)
Dimensions	Standard VersaMax module footprint
Operating Temp	0 to 30 deg C
Power Consumption	243 mA (up to 435 mA maximum current draw)
Output Channels	8 individually isolated points
Contact Form	Form A (Normally Open)
Contact Material	Silver alloy
Relay Architecture	Fixed coil, moving armature
Output Signal Voltage	0 to 125 VDC; 0 to 265 VAC (47 to 63 Hz)
Contact Current Rating	2.0 A (5 to 265 VAC / 5 to 30 VDC); 0.2 A (31 to 125 VDC); 10 mA minimum per point
Response Time	10 ms maximum (On/Off)
Maximum Switching Frequency	20 cycles per minute
Channel Isolation	250 VAC continuous; 1500 VAC for 1 minute (channel-to-channel and channel-to-logic)
Status Diagnostics	Module OK LED, 8 individual output channel LEDs

Backplane Bus Communication Velocity & I/O Density Scaling

The IC200MDL930 incorporates 8 individually isolated Form A relay contacts, delivering high channel-to-channel isolation while supporting flexible I/O density scaling across VersaMax backplane base units. Interfacing directly with the local CPU carrier, the module maintains deterministic backplane bus communication velocity during output image updates. Onboard firmware flash compatibility ensures synchronized relay state transitions across distributed racks, preventing backplane communication timeouts when managing inductive field actuators.

Frequently Asked Questions

Q: Does the IC200MDL930 contain internal protective fuses or snubber circuits for the relay contacts?

A: No, the module does not include internal output fuses or snubber circuits. External protection circuits, such as fast-acting inline fuses or inductive suppression networks, are recommended for field wiring connected to reactive loads.

Q: What are the backplane current draw requirements for the IC200MDL930?

A: The module draws a nominal 243 mA from the 5 VDC backplane bus, with a maximum total backplane current consumption of 435 mA when all eight relay coils are fully energized.

Field Installation Guidelines

Backplane Carrier Engagement: Align the module with the carrier base sub-assembly and push firmly until the locking tabs snap into place. Ensure power is removed from the carrier backplane prior to installation or removal.
Field Wiring and Contact Isolation: Wire field loads to the designated carrier terminals. Because each relay channel is individually isolated, distinct external AC or DC power sources may be connected to individual channels within the specified 0-265 VAC / 0-125 VDC voltage limits.
Shielding and Noise Suppression: Install RC snubbers or freewheeling diodes directly across inductive field loads to prevent arc discharge across the silver alloy contacts and maintain systemic noise immunity.

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