IC694MDL758 GE Discrete Output Module

IC694MDL758 GE Fanuc PACSystems RX3i Discrete Output Module

IC694MDL758 GE Fanuc PACSystems RX3i Discrete Output Module

Availability: 10 left in stock

The GE IC694MDL758, also cataloged as the IC694MDL758 Discrete Output Module, operates as a dedicated hardware component for solid-state switching...

SKU: IC694MDL758

Manufacturer: GE Fanuc
Product No.: IC694MDL758
Product Type: Digital Output Modules
Product Origin: USA
Payment:T/T, Western Union
Weight: 200g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

The GE IC694MDL758, also cataloged as the IC694MDL758 Discrete Output Module, operates as a dedicated hardware component for solid-state switching of low-voltage direct current loads within PACSystems RX3i networks.

Hardware Specifications

Parameter	Specification
Model	IC694MDL758
Brand	GE Fanuc / Emerson
Origin	Factory standard
Weight	1.36 kg (3.00 lbs)
Dimensions	Single-slot chassis occupancy
Operating Temp	0 to 60 deg C
Power Consumption	250 mA maximum at 5.0 VDC (from backplane bus)
Channel Density	32 discrete outputs
Output Grouping	2 isolated groups (16 channels per group)
Output Logic Type	Positive logic (Sourcing)
Rated Operating Voltage	12 / 24 VDC
Output Voltage Range	10.2 to 28.8 VDC
Output Current per Point	0.5 A maximum
Output Current per Group	8.0 A maximum
Inrush Current Rating	5.4 A for 10 ms (without an ESCP trip)
Maximum Response Time	0.5 ms
Isolation	Galvanic group-to-group isolation
Status Indicators	32 green channel LEDs, 2 fault LEDs, 1 module status LED
Compatible Terminal Blocks	IC694TBB032 (box-style) or IC694TBS032 (spring-style)
System Compatibility	PACSystems RX3i CPU slots only (Incompatible with Series 90-30)

Deterministic Networks and I/O Density Scaling

The module executes discrete automation routines by shifting 32 solid-state sourcing outputs across the local PACSystems RX3i parallel backplane. To maintain deterministic networks performance when scaling high-density electronic modules inside the chassis, the device draws a constant 250 mA from the 5.0 VDC backplane bus. Built-in electronic short-circuit protection (ESCP) monitors the physical circuit loops across each group common. If a localized short-circuit occurs, the ESCP infrastructure isolates the fault, bounds the internal thermal heat sink dissipation profile, and routes a digital diagnostic error frame directly to the master CPU without disrupting backplane bus communication velocity.

Frequently Asked Questions

Q: Does this module support live insertion and extraction (hot-swapping) during controller operation?

A: Yes. The PACSystems RX3i system architecture permits hot-swap execution of this module, provided the technician complies with the grounding practices, backplane capacity limits, and mechanical extraction guidelines specified in the RX3i installation manual.

Q: How does the module handle a sudden loss of field-side supply voltage within an output group?

A: The hardware logic incorporates diagnostic sub-circuits that detect the loss of external field power for each of the two isolated groups. Upon detection, it toggles a dedicated fault LED indicator on the front panel and generates a structured fault report for transmission to the RX3i controller.

Q: Is this module backward compatible with older Series 90-30 PLC backplanes?

A: No. The firmware and electrical interface of the module are designed exclusively for the PACSystems RX3i platform. It cannot be mapped or installed within a Series 90-30 chassis.

Field Installation Guidelines

Isolate all external direct current field loop power supplies and backplane inputs before initiating terminal connections or module placement.
Match the structural enclosure of the module with the precise physical slot paths of the target RX3i baseplate.
Push the module firmly into the slot until the upper and lower plastic locking tabs click onto the chassis rail hooks.
Seat either the IC694TBB032 box-style or IC694TBS032 spring-style 32-point terminal block into the front faceplate connection pins.
Lay all low-voltage 12/24 VDC sourcing signal lines in segregated cable trays positioned at a minimum distance of 30 cm from high-power AC lines or motor control conductors to minimize electromagnetic interference.

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