IS200AEBMG1AFB GE Mark VI Datasheet & Technical Manual

IS200AEBMG1AFB GE Mark VI Advanced Engineering Bridge Module

IS200AEBMG1AFB GE Mark VI Advanced Engineering Bridge Module

Availability: 10 left in stock

The GE IS200AEBMG1AFB, also cataloged as the IS200AEBMG1A Advanced Engineering Bridge Module, operates as a dedicated hardware component for high-speed...

SKU: IS200AEBMG1AFB

Manufacturer: GE Fanuc
Product No.: IS200AEBMG1AFB
Product Type: Interface Modules
Product Origin: USA
Payment:T/T, Western Union
Weight: 500g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

The GE IS200AEBMG1AFB, also cataloged as the IS200AEBMG1A Advanced Engineering Bridge Module, operates as a dedicated hardware component for high-speed signal routing and interface bridging within GE Mark VI Speedtronic platforms.

Hardware Specifications

Parameter	Specification
Model	IS200AEBMG1AFB
Brand	GE (General Electric)
Origin	USA
Operating Temp	-30 to 65 deg C
Power Consumption	Subrack Backplane Power Draw
Functional Acronym	AEBM
Assembly Type	Normal Assembly
PCB Coating	Normal Coating
Frame Mounting	Carrier Frame 1151x122OBQ01
Revision Level	Three-Fold Revision (AFB) with Backward Compatibility for First Two Revisions
System Series	Mark VI Speedtronic

Backplane Bus Communication Velocity & Deterministic Networks

The IS200AEBMG1AFB interfaces directly with VME rack structures via its carrier frame mounting layout to support localized signals. Optimized for backplane bus communication velocity, the board facilitates real-time data frame transfers between processor nodes and secondary I/O units across deterministic networks. Firmware flash compatibility guarantees synchronous execution with Mark VI control routines, preventing processing latencies and maintaining signal integrity across the backplane.

Frequently Asked Questions

Q: How is the IS200AEBMG1AFB board mechanically secured inside a VME rack cabinet?

A: The circuit board is mounted to a carrier frame designated 1151x122OBQ01, featuring extended screw mounts along both long sides for secure installation in VME rack assemblies without a standard faceplate.

Q: What is the backward compatibility scope for the AFB revision level of this module?

A: The three-fold revision version (AFB) maintains functional backward compatibility with the first two revisions of the IS200AEBMG1A group.

Q: Does the IS200AEBMG1AFB PCB feature conformal coating?

A: No, the board is manufactured with a normal PCB coating style and standard assembly configuration.

Field Installation Guidelines

Isolate and lock out all main power connections to the target VME subrack enclosure prior to board installation or removal.
Put on an anti-static ESD grounding wrist strap connected to an unpainted chassis ground point.
Align the side flanges of the 1151x122OBQ01 carrier frame with the designated card slot guide rails.
Slide the module assembly smoothly backward until backplane connectors align fully with the rack receivers.
Tighten all side retaining screws on the carrier frame to secure the module against vibration and establish chassis ground continuity.
Re-check all hardware interface fasteners and ground straps before re-energizing the rack power supply.

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