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The GE Fanuc IC697CHS782, also cataloged as the IC697CHS782 Integrator Rack, operates as a dedicated hardware component for multi-module physical mounting and backplane bus interconnection within Series 90-70 platforms.

Hardware Specifications

Parameter Specification
Model IC697CHS782
Brand GE Fanuc / Emerson
Origin USA
Weight 5.84 kg (12.88 lbs)
Dimensions Standard 17-slot chassis frame (0.8 in slot spacing)
Operating Temp -20 to 60 deg C
Power Consumption Passive chassis (power supplied by plugged power supply module)
Slot Capacity 17 slots
Slot Spacing 0.8 in (20.3 mm)
Mounting Type Rear panel mount
Cooling Method Natural convection
Storage Temp -40 to 85 deg C
Relative Humidity 5% to 95% (non-condensing)
Installation Altitude Up to 1000 m

Backplane Bus Communication Velocity & I/O Density Scaling

The IC697CHS782 chassis structure establishes the physical backplane framework required to maintain high backplane bus communication velocity across up to 17 module positions. The 0.8-inch slot spacing standard ensures optimal spatial separation for thermal management during natural convection cooling while maximizing module density scaling per rack. Onboard backplane trace routing maintains signal integrity for high-speed processor access, memory modules, and field communication interfaces, supporting consistent firmware flash compatibility execution across installed controller nodes.

Frequently Asked Questions

Q: What is the maximum module capacity of the IC697CHS782 chassis frame?

A: The integrator rack provides 17 standard hardware slots spaced at 0.8-inch intervals for Series 90-70 CPU, power supply, and I/O modules.

Q: How is thermal dissipation handled within the IC697CHS782 rack structure?

A: Heat removal is achieved via natural convection cooling across the operating range of -20 to 60 deg C, requiring unobstructed vertical airflow above and below the chassis assembly.

Q: Does the IC697CHS782 integrator rack draw electrical current from an external source?

A: No, the chassis frame is a passive backplane structure; operating power for backplane logic buses is sourced directly from an installed rack power supply module.

Field Installation Guidelines

  1. Mount the chassis securely to a grounded rear panel or enclosure frame using all designated mounting holes to provide structural rigidity.
  2. Maintain a minimum vertical clearance of 100 mm (4 inches) above and below the rack frame to allow adequate natural convection airflow.
  3. Ensure the main panel ground wire is firmly attached to the chassis protective earth (PE) terminal prior to applying power to the system power supply.
  4. Align module top and bottom card guides carefully before sliding modules into backplane connector slots to prevent pin bending.

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