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The GE Fanuc IC694MDL741, also cataloged as the IC694MDL741 Discrete Output Module, operates as a dedicated hardware component for 12/24 VDC negative logic signal switching within PACSystem RX3i platforms.

Hardware Specifications

Parameter Specification
Model IC694MDL741
Brand GE Fanuc / Emerson
Origin USA
Weight 0.14 kg (0.31 lbs)
Dimensions Standard RX3i single-slot module
Operating Temp 0 to 60 deg C
Power Consumption 110 mA from 5 VDC backplane bus (all outputs ON)
Number of Channels 16 (2 groups of 8 channels)
Output Voltage Range 12 to 24 VDC (+20%, -15%)
Output Current 0.5 A per point; 2.0 A per common
On-State Voltage Drop 0.5 V maximum
Off-State Leakage Current 1.0 mA maximum
Response Times On: 2 ms maximum / Off: 2 ms maximum
Isolation 250 VAC continuous (1500 VAC for 1 minute) Field-to-Backplane and Group-to-Group

Backplane Bus Communication Velocity & I/O Density Scaling

The IC694MDL741 exchanges discrete channel states directly via the high-speed RX3i backplane bus, enabling deterministic update rates across all 16 output points. Optimized for high-density I/O configurations, the module distributes current consumption over two distinct 8-channel groups while keeping backplane power draw capped at 110 mA at 5 VDC. Internal firmware flash compatibility ensures synchronized CPU logic execution with real-time LED status reflection across active sinking load paths.

Frequently Asked Questions

Q: What is the backplane current draw for the IC694MDL741 when all 16 channels are active?

A: The module draws 110 mA from the internal 5 VDC backplane bus when all 16 output channels are in the ON state.

Q: What are the current capacity limits per point and per common group on this module?

A: Each individual channel supports up to 0.5 A output current, with a total maximum rating of 2.0 A per 8-channel common group.

Q: What isolation level exists between the two output channel groups?

A: The module provides group-to-group optical isolation rated at 250 VAC continuous and 1500 VAC for 1 minute.

Field Installation Guidelines

  1. Power down the PACSystem RX3i rack prior to inserting or removing the IC694MDL741 module to avoid damage to backplane connector pins.
  2. Slide the module into the selected rack slot and press firmly until the top and bottom mounting latches snap into place on the baseplate.
  3. Wire the field loads observing negative logic (sinking output) conventions, ensuring external 12/24 VDC power connections do not exceed the +20% upper voltage boundary.
  4. Separate DC signal wiring from high-voltage AC cables inside the panel ducting to minimize electromagnetic noise coupling onto field circuits.

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