The GE IC697CPM925 serves as the primary IC697CPM925 Central Processing Unit utilized to execute high-speed industrial logic and arithmetic operations across Series 90-70 platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC697CPM925 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 0.82 kg (1.81 lbs) |
| Dimensions | Standard single-slot Series 90-70 module footprint |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Sourced from backplane bus |
| Processor Frequency | 64 MHz |
| Processing Architecture | 32-bit floating-point |
| User Memory Capacity | 1 Mbyte |
| Discrete I/O Capacity | 12 K discrete inputs/outputs |
Firmware Flash Compatibility & I/O Density Scaling
The IC697CPM925 handles complex system configurations by facilitating extensive I/O density scaling, managing up to 12 K discrete I/O points over standard bus channels. Real-time calculations are governed by its integrated 64 MHz 32-bit floating-point processor. The system architecture supports modular updates via direct firmware flash compatibility, allowing integration with co-processors and communication cards across the rack backplane without demanding supplementary communication velocity licenses.
Frequently Asked Questions
Q: How is the 1 Mbyte user memory on the CPU module protected from volatile data loss?
A: Data preservation during power outages is maintained by the backup battery located on the system power supply module, which distributes trickle current to the RAM through the backplane bus.
Q: Does the IC697CPM925 support hot-swap insertion or removal?
A: No. The module must be installed or removed only when the rack power supply is completely switched off to prevent transient voltage spikes from damaging the internal bus connection pins.
Field Installation Guidelines
- Slot Allocation: The CPU module must be installed in Slot 1 of the primary Series 90-70 rack chassis.
- Electrostatic Grounding: Maintain continuous grounding via an ESD wrist strap during installation to prevent damage to the CMOS microprocessor components.
- Bus Connection: Align the module side card guides and press firmly until the backplane connector is fully seated, then engage the top and bottom chassis locking tabs.
- Battery Check: Verify that the power supply backup battery is connected and active prior to transferring logic programs to prevent volatile memory clears on subsequent power cycles.
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