BMXDRA0805 Schneider Electric Modicon X80 Datasheet & Technical Manual

Schneider Electric BMXDRA0805 8-Channel Discrete Relay Output Module

Schneider Electric BMXDRA0805 8-Channel Discrete Relay Output Module

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Schneider Electric BMXDRA0805 Modicon X80 Discrete Output Module Configured for discrete relay contact switching across Modicon X80 platform networks, the...

SKU: BMXDRA0805

Manufacturer: Schneider
Product No.: BMXDRA0805
Product Type: Digital Output Modules
Product Origin: France
Payment:T/T, Western Union
Weight: 145g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Schneider Electric BMXDRA0805 Modicon X80 Discrete Output Module

Configured for discrete relay contact switching across Modicon X80 platform networks, the Schneider Electric BMXDRA0805 (BMXDRA0805 Discrete Output Module) provides direct physical/electrical execution. This expansion component drives independent external circuits via 8 electromechanical relay outputs, translating internal CPU logic variables into physical contact operations while isolating field-side transients from the controller backplane.

Hardware Specifications

Parameter	Specification
Model	BMXDRA0805
Brand	Schneider Electric
Origin	China
Weight	0.145 kg (0.320 lb)
Dimensions	55 x 110 x 120 mm (Package Height x Width x Length)
Operating Temp	0 to 60 deg C
Power Consumption	2 W maximum
Output Channels	8 channels (Form A, Normally Open contacts)
Nominal Voltage Range	24-250 VAC / 5-30 VDC
Max Current per Channel	2 A
Max Current per Module	16 A
Minimum Switching Current	10 mA @ 5 VDC
Response Time	< 10 ms activation / < 8 ms deactivation
Insulation Resistance	> 10 MOhm @ 500 VDC
Dielectric Strength	2000 VAC 50/60 Hz for 1 min
Bus Current Requirement	250 mA
IP Protection Rating	IP20
Relative Humidity	5% to 95% @ 55 deg C non-condensing

Industrial Drive and Network Control Characteristics

The hardware orchestrates real-time control actions through integrated backplane bus communication velocity frameworks native to the X80 rack architecture. The digital logic parameters synchronize directly with upper-layer Profinet / EtherNet/IP deterministic networks, enabling automated hardware mapping and strict channel status tracking via designated LED groupings. This internal bus management engine facilitates high-density I/O density scaling profiles, balancing fast contact mechanical response times with internal safety loops to ensure deterministic data processing under high ambient load variations.

Frequently Asked Questions

Q: What are the consequences of switching a field load that draws less than the specified minimum current rating?

A: The physical contact materials within the module require a minimum loop load of 10 mA at 5 VDC to break down surface oxidation. Operating below this threshold increases overall contact resistance over time, leading to unreliable signal validation and intermittent open-circuit logic states.

Q: Is this specific Modicon X80 module hot-swappable during runtime processing?

A: Yes, the X80 backplane infrastructure allows for active module insertion and removal under power (RIUP). However, operators must disconnect all external field-side voltage potentials from the module's terminal block prior to extraction to prevent electrical arcing or unintended machine actuation.

Q: How do the internal protection circuits handle high-voltage spikes caused by inductive field loads?

A: The module relies on standard galvanic isolation rated at 2000 VAC between the internal bus structure and the output loops. When managing inductive field components like solenoids or large interposing relays, engineers must supply external RC snubbers for AC loads or free-wheeling diodes for DC loads to prevent rapid contact degradation.

Field Installation Guidelines

Install the module into any available slot of a Modicon X80 chassis by aligning the bottom structural hook with the rack slot, then pivoting the module top inward until the upper lock clicks into position. Tighten the grounding screws to secure continuity between the internal shield and the common panel enclosure backplate ground. Maintain unrestricted airflow around the ventilation holes to keep operating temperatures within the 0 to 60 deg C threshold.

Field cables must use shielded, twisted-pair variants with conductor dimensions fitting the designated terminal block profile. Route all high-voltage AC load wiring in dedicated wire ducts separated from low-voltage digital input and analog instrumentation lines to eliminate crosstalk. Ground the overall cable shielding exclusively at a single, low-impedance grounding point located at the enclosure entry bulkhead.

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