Configured for high-density discrete signal execution in Modicon Premium platforms, the SCHNEIDER ELECTRIC TSXDST2472 (TSXDST2472 Discrete Output Module) provides direct physical/electrical execution.
| Parameter | Specification |
|---|---|
| Model | TSXDST2472 |
| Brand | Schneider Electric |
| Origin | Manufacturer specified |
| Weight | 0.4 kg |
| Dimensions | 35.5 x 141 x 125 mm |
| Operating Temp | 0 deg C to 60 deg C |
| Power Consumption | Logic-side powered |
| Channel Count | 24 Discrete Outputs |
| Output Type | Solid-State Transistor (Source) |
| Isolation | 1500 Vrms (output to logic) |
The TSXDST2472 optimizes backplane bus communication velocity by utilizing high-density 24-point logic mapping within the Modicon Premium rack architecture. This module supports I/O density scaling, allowing for significant footprint reduction in control cabinets compared to conventional electromechanical relay banks. The solid-state output structure ensures deterministic switching behavior, facilitating precise control timing for high-cycle rate actuators. Throughput efficiency is maintained via the integrated backplane interface, which manages handshake protocols between the CPU and the output stage to ensure state-change synchronization.
Q: Can this module be hot-swapped while the Modicon Premium rack is under power?
A: No. The TSXDST2472 is not designed for hot-swapping. You must remove power from the I/O backplane before extracting or inserting the module to prevent electrical damage to the backplane pins or the module's internal circuitry.
Q: How does the module handle a sustained short-circuit on an output channel?
A: The module incorporates electronic protection per channel. If a short-circuit occurs, the specific output stage will trigger an internal cutoff to prevent overheating or damage. Once the fault is removed, the channel state must be refreshed by the controller to clear the error condition.
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