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SCHNEIDER ELECTRIC TSXDST2472 Modicon Premium Discrete Output Module

Configured for high-density discrete signal execution in Modicon Premium platforms, the SCHNEIDER ELECTRIC TSXDST2472 (TSXDST2472 Discrete Output Module) provides direct physical/electrical execution.

Hardware Specifications

Parameter Specification
Model TSXDST2472
Brand Schneider Electric
Origin Manufacturer specified
Weight 0.4 kg
Dimensions 35.5 x 141 x 125 mm
Operating Temp 0 deg C to 60 deg C
Power Consumption Logic-side powered
Channel Count 24 Discrete Outputs
Output Type Solid-State Transistor (Source)
Isolation 1500 Vrms (output to logic)

Backplane Bus Communication and I/O Density Scaling

The TSXDST2472 optimizes backplane bus communication velocity by utilizing high-density 24-point logic mapping within the Modicon Premium rack architecture. This module supports I/O density scaling, allowing for significant footprint reduction in control cabinets compared to conventional electromechanical relay banks. The solid-state output structure ensures deterministic switching behavior, facilitating precise control timing for high-cycle rate actuators. Throughput efficiency is maintained via the integrated backplane interface, which manages handshake protocols between the CPU and the output stage to ensure state-change synchronization.

Frequently Asked Questions

Q: Can this module be hot-swapped while the Modicon Premium rack is under power?

A: No. The TSXDST2472 is not designed for hot-swapping. You must remove power from the I/O backplane before extracting or inserting the module to prevent electrical damage to the backplane pins or the module's internal circuitry.

Q: How does the module handle a sustained short-circuit on an output channel?

A: The module incorporates electronic protection per channel. If a short-circuit occurs, the specific output stage will trigger an internal cutoff to prevent overheating or damage. Once the fault is removed, the channel state must be refreshed by the controller to clear the error condition.

Field Installation Guidelines

  1. Mounting: Secure the TSXDST2472 into an available slot on the Modicon Premium rack. Ensure the module is fully aligned with the backplane guides before applying pressure to seat the connector.
  2. Wiring: Use a compatible removable terminal block (e.g., TSXBLY01) for all field connections. Verify that the wire gauge is suitable for the 0.5 A per channel load and ensure that the 24 VDC source common is appropriately referenced to the system earth ground.
  3. Verification: Confirm that the output logic (Source) matches the load requirements of the field actuators. Prior to full system integration, verify the status LEDs on the front panel to ensure each channel reflects the commanded state from the CPU.

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