Yokogawa F3WD64-3P FA-M3 Digital I/O Module Configured for high-density digital signal interfacing in FA-M3 rack systems, the Yokogawa F3WD64-3P (F3WD64 Digital I/O Module) provides direct physical/electrical execution across industrial automation control networks. Suffix Breakdown & Model Matrix The catalog number F3WD64-3P identifies a specific hardware configuration within the Yokogawa FA-M3 range: F3WD64: Base module series designation for 64-point high-density digital input/output hardware. -3P: Suffix code indicating 32 transistor-sink inputs (24 VDC, 4.1 mA) and 32 transistor-sink outputs (24 VDC, 0.1 A per point) terminated via dual 40-pin connectors. Hardware Specifications Parameter Specification Model F3WD64-3P Brand Yokogawa Origin Japan Weight 0.12 kg Dimensions 100 x 28 x 90 mm Operating Temp 0 to +55 deg C Power Consumption 0.85 W (170 mA at 5 VDC internal backplane) Input Channel Count 32 DC sink points Output Channel Count 32 transistor sink points Rated Logic Voltage 24 VDC (20.4 to 26.4 VDC operating range) Galvanic Isolation Photocoupler isolation, 1500 VAC for 1 min External Field Power 24 VDC at 55 mA Process Control & Channel Isolation Profiles The F3WD64-3P module uses internal photocoupler barriers to separate field-side 24 VDC loops from sensitive 5 VDC backplane logic circuitry. Ground loops across long field wiring runs cannot pass noise to the CPU bus because internal transformers maintain a 1500 VAC isolation threshold. Furthermore, dynamic channel-to-channel isolation architecture prevents voltage spikes on discrete input channels from affecting adjacent transistor outputs. Integral active clamps protect transistor output drivers against inductive voltage kickback during rapid solenoid switching cycles, while built-in thermal monitors continuously execute short-circuit and overheat shutdown protocols. Frequently Asked Questions Q: Does removing external 24 VDC field power trip a backplane fault on the host FA-M3 controller? A: No, loss of external 24 VDC field power affects only output driver states and field sensing loops while internal CPU backplane communication remains fully active. Q: What happens when an individual output channel experiences a sustained short-circuit condition? A: The affected output channel activates its internal thermal shutdown mechanism to limit current draw, protecting the transistor driver without interrupting logic execution on adjacent channels. Q: Can installation teams utilize custom wiring harnesses with the dual 40-pin connectors? A: Yes, wiring technicians can terminate field conductors to standard MIL-style 40-pin ribbon connectors or discrete terminal block interface modules without degrading signal timing. Field Installation Guidelines Insert the module firmly into the designated slot on the FA-M3 base module rack until the top and bottom latch levers seat completely. Route high-density 40-pin connector signal cables in separate wire raceways, keeping a minimum distance of 100 mm from high-voltage AC power wiring. Connect external 24 VDC field power supplies using dedicated twisted-pair conductors to minimize electromagnetic interference across sink output common lines. Verify that field sensor shield drain wires attach directly to the master functional ground bar rather than the module housing frame. Ensure cabinet design permits unobstructed vertical airflow around the FA-M3 rack enclosure to maintain ambient operating temperatures between 0 and +55 deg C.

Yokogawa F3WD64-3P FA-M3 64-Point Digital I/O Module

Yokogawa F3WD64-3P FA-M3 64-Point Digital I/O Module

Availability: 10 left in stock

Yokogawa F3WD64-3P FA-M3 Digital I/O Module Configured for high-density digital signal interfacing in FA-M3 rack systems, the Yokogawa F3WD64-3P (F3WD64...

SKU: F3WD64-3P

Manufacturer: Yokogawa
Product No.: F3WD64-3P
Product Type: Communication Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 120g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Yokogawa F3WD64-3P FA-M3 Digital I/O Module

Configured for high-density digital signal interfacing in FA-M3 rack systems, the Yokogawa F3WD64-3P (F3WD64 Digital I/O Module) provides direct physical/electrical execution across industrial automation control networks.

Suffix Breakdown & Model Matrix

The catalog number F3WD64-3P identifies a specific hardware configuration within the Yokogawa FA-M3 range:

F3WD64: Base module series designation for 64-point high-density digital input/output hardware.
-3P: Suffix code indicating 32 transistor-sink inputs (24 VDC, 4.1 mA) and 32 transistor-sink outputs (24 VDC, 0.1 A per point) terminated via dual 40-pin connectors.

Hardware Specifications

Parameter	Specification
Model	F3WD64-3P
Brand	Yokogawa
Origin	Japan
Weight	0.12 kg
Dimensions	100 x 28 x 90 mm
Operating Temp	0 to +55 deg C
Power Consumption	0.85 W (170 mA at 5 VDC internal backplane)
Input Channel Count	32 DC sink points
Output Channel Count	32 transistor sink points
Rated Logic Voltage	24 VDC (20.4 to 26.4 VDC operating range)
Galvanic Isolation	Photocoupler isolation, 1500 VAC for 1 min
External Field Power	24 VDC at 55 mA

Process Control & Channel Isolation Profiles

The F3WD64-3P module uses internal photocoupler barriers to separate field-side 24 VDC loops from sensitive 5 VDC backplane logic circuitry. Ground loops across long field wiring runs cannot pass noise to the CPU bus because internal transformers maintain a 1500 VAC isolation threshold. Furthermore, dynamic channel-to-channel isolation architecture prevents voltage spikes on discrete input channels from affecting adjacent transistor outputs. Integral active clamps protect transistor output drivers against inductive voltage kickback during rapid solenoid switching cycles, while built-in thermal monitors continuously execute short-circuit and overheat shutdown protocols.

Frequently Asked Questions

Q: Does removing external 24 VDC field power trip a backplane fault on the host FA-M3 controller?

A: No, loss of external 24 VDC field power affects only output driver states and field sensing loops while internal CPU backplane communication remains fully active.

Q: What happens when an individual output channel experiences a sustained short-circuit condition?

A: The affected output channel activates its internal thermal shutdown mechanism to limit current draw, protecting the transistor driver without interrupting logic execution on adjacent channels.

Q: Can installation teams utilize custom wiring harnesses with the dual 40-pin connectors?

A: Yes, wiring technicians can terminate field conductors to standard MIL-style 40-pin ribbon connectors or discrete terminal block interface modules without degrading signal timing.

Field Installation Guidelines

Insert the module firmly into the designated slot on the FA-M3 base module rack until the top and bottom latch levers seat completely.
Route high-density 40-pin connector signal cables in separate wire raceways, keeping a minimum distance of 100 mm from high-voltage AC power wiring.
Connect external 24 VDC field power supplies using dedicated twisted-pair conductors to minimize electromagnetic interference across sink output common lines.
Verify that field sensor shield drain wires attach directly to the master functional ground bar rather than the module housing frame.
Ensure cabinet design permits unobstructed vertical airflow around the FA-M3 rack enclosure to maintain ambient operating temperatures between 0 and +55 deg C.

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