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Yokogawa AAT145-S50 CENTUM VP Module

The Yokogawa AAT145-S50, also cataloged as the AAT145 TC/mV Input Module, operates as a dedicated hardware component for temperature and low-voltage measurement within CENTUM VP and FCN/FCJ network platforms. The module interfaces directly with field sensors, executing continuous signal conversion and monitoring physical parameters through isolated hardware processing blocks.

Suffix Breakdown & Model Matrix

  • Base Model (AAT145): Standard 16-channel isolated input architecture supporting Thermocouple, RTD, millivolt, and potentiometer field signals.
  • S Suffix: Indicates the standard functional baseline version of the hardware assembly.
  • 5 Suffix: Denotes the hardware variant configured with no explosion protection ratings.
  • 0 Suffix: Represents the basic type sub-classification within the factory production matrix.
  • S1 Option: Refers to specific hardware configuration baseline packaging updates under the identical electrical specification.

Hardware Specifications

Parameter Specification
Model AAT145-S50
Brand Yokogawa Electric Corporation
Origin Japan
Weight 0.3 kg (Shipping Weight: 2 Kg)
Dimensions 127 x 32 x 130 mm
Operating Temp -10 to +55 deg C (extended baseline option -20 to +70 deg C)
Power Consumption Max 4.5 W (350 mA at 5 VDC)
Input Channels 16 isolated channels
Supported Thermocouples B, C, E, J, K, L, N, R, S, T, U, W
Supported RTDs Pt100, JPt100 (3-wire configuration)
Measurement Range -200 to +1800 deg C (sensor type dependent)
Accuracy +/-0.1% of span (typical +/-40 uV for TC/mV inputs)
Isolation Voltage 500 VDC between channels; 1500 VAC at card level
Conversion Speed 100 ms per channel
Burnout Detection Automatic sensor failure detection (upscale/downscale limits)
Cold Junction Compensation Built-in physical hardware internal CJC
External Connection KS1/KS8 dedicated interface cables
Mounting Style DIN rail compatible installation

Process Control & DCS Instrumentation

The Yokogawa AAT145-S50 maintains system-side protection through rigorous channel-to-channel isolation rated at 500 VDC, preventing localized field ground loops from corrupting adjacent signal paths. The hardware incorporates dynamic cold junction compensation (CJC) directly on the terminal interface, correcting thermal drift variations across thermocouple input loops in real time. Continuous burnout detection circuitry applies bias voltage across the terminal nodes, forcing the data word to upscale or downscale limits within 100 ms of a field wire fracture to trigger safe state loops.

Frequently Asked Questions

Q: How does the channel conversion latency scale when all 16 paths are active?

A: The onboard analog-to-digital matrix features parallelized signal execution, maintaining a hardware conversion latency limit of 100 ms per channel irrespective of input type assignment configuration.

Q: Can this module accept 3-wire RTD and potentiometer signals simultaneously on adjacent channels?

A: Yes, the firmware allows independent channel profiling, permitting mixed deployments of thermocouples, RTDs, millivolt loops, and potentiometers across the 16 isolated terminal nodes.

Q: What baseline mechanism mitigates high-frequency common mode noise on the low-voltage inputs?

A: The card incorporates low-pass hardware filters alongside its 1500 VAC card-level galvanic isolation barrier to attenuate electromagnetic interference before the signal passes to the internal processor bus.

Field Installation Guidelines

  • Grounding Baseline: Connect the DIN rail assembly directly to the instrumentation functional earth bus. Ensure the reference ground path maintains a resistance value below 1 Ohm to guarantee the operational performance of the channel-to-channel isolation circuitry.
  • Cable Routing Restrictions: Separate the KS1/KS8 signal cables from high-voltage motor power wiring by a physical space of at least 300 mm. Utilize twisted shielded pairs for all field sensor extensions to minimize external induction fields.
  • Thermal Expansion Spacing: When operating the module near the upper limit of +55 deg C, allow a minimum horizontal ventilation gap of 10 mm between adjacent hardware housings on the DIN rail to prevent localized thermal buildup.
  • Thermocouple Compensating Extension Wires: Verify that all extension wiring matches the specific thermocouple type assigned to the module input terminal. Incorrect alloy matching will induce cold junction calculation faults at the hardware conversion stage.

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