ADV851-P50 YOKOGAWA FIO Series Datasheet & Technical Manual

Digital Output Modules | YOKOGAWA ADV851-P50 FIO Series

Digital Output Modules | YOKOGAWA ADV851-P50 FIO Series

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YOKOGAWA ADV851-P50 FIO Digital Output Module Configured for high-density discrete actuation signaling in distributed control systems, the YOKOGAWA ADV851-P50, also...

رمز المنتج: ADV851-P50

Manufacturer: Yokogawa
Product No.: ADV851-P50
Product Type: Digital Output Modules
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 300g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

YOKOGAWA ADV851-P50 FIO Digital Output Module

Configured for high-density discrete actuation signaling in distributed control systems, the YOKOGAWA ADV851-P50, also cataloged as the ADV851 Digital I/O Module, operates as a dedicated hardware component for large-scale binary command execution within CENTUM VP, CENTUM CS, and ProSafe-RS networks. The hardware drives external field loads including solenoids, interlock relays, alarms, and indicators through 64 isolated current-sink transistor pathways referencing an external 24 VDC loop network.

Hardware Specifications

Parameter	Specification
Model	ADV851-P50
Brand	YOKOGAWA
Origin	Japan
Weight	0.3 kg net (1.4 kg with shipping packaging)
Dimensions	130 x 119.9 x 32.8 mm
Operating Temp	0 to 55 deg C
Power Consumption	700 mA at 5 VDC
Output Channels	64 isolated digital outputs
Output Voltage	24 VDC nominal (operational range: 20.4 to 26.4 VDC)
Output Type	Current sink transistor
Max Load Current	100 mA per channel
Response Time	Less than or equal to 3 ms typical (less than or equal to 5 ms maximum)
Functions	ON/OFF status output, pulse width output (8 ms to 7200 s), time-proportioning output
Isolation	2 kV AC signal-to-system for 1 minute; 500 V AC between commons per 16 channels
Leak Current (OFF)	Less than or equal to 0.1 mA
External Connection	MIL connector cable (AKB337)
Environmental Protection	ISA Standard G3 conformal coating

Channel-to-Channel Isolation and DCS Instrumentation Features

The architecture incorporates a 64-channel high-density configuration structured into four isolated common blocks containing 16 lines each. Galvanic isolation barriers rated at 2 kV AC protect the internal system backplane logic from line surges, noise induction, and plant ground differential potentials. The current-sink transistor array is integrated onto a multi-layer board assembly featuring standard factory-applied ISA Standard G3 conformal coating to inhibit copper dendrite formation and surface contamination from corrosive gases or environmental humidity. Internal digital processing components sustain edge execution and sequence monitoring, allowing the module to natively run pulse width timing loops from 8 ms up to 7200 s alongside standard time-proportioning output profiles.

Frequently Asked Questions

Q: What are the primary backplane current loading considerations when installing the ADV851-P50 inside an FIO node rack?

A: The module demands approximately 700 mA from the internal 5 VDC system bus. The system design engineer must calculate the aggregate current requirements of all adjacent cards inside the specific node frame to prevent exceeding the maximum current budget allocated by the node power module.

Q: How are the 64 current-sink channels grouped regarding external voltage isolation references?

A: The channels are subdivided into separate 16-channel blocks, each isolated from one another up to 500 V AC. Each block maintains its own dedicated common line terminal via the external MIL connector layout, which allows distinct loop sectors to run on segregated 24 VDC external loops.

Q: Does the current-sink transistor output circuitry include integrated short-circuit thermal shutdown protections?

A: The transistor outputs are rated for a strict maximum continuous load current of 100 mA per channel. Sustained overcurrent or line short circuits will damage the solid-state switching junctions, necessitating external line fuses or current-limiting devices on each output leg.

Field Installation Guidelines

MIL Cable Coupling: Route field wiring connections via the standardized AKB337 MIL connector cable interface. Match the alignment keys cleanly prior to engaging the locking clips to protect the connection interface from structural pin deflection.
Shield Ground Management: Terminate the multi-conductor signal shields at the single-point cabinet functional ground rail. Ensure all shield tails remain open and ungrounded at the field device terminal boxes to prevent circulating ground currents.
Thermal Spatial Clearance: Maintain specified top and bottom air convective pathways when installing the card chassis inside the node rack framework. Ensure the ambient environment within the enclosure stays within the 0 to 55 deg C operating band.
Module Seating: Guide the circuit card straight along the node slot paths. Push the mechanical retention handles inward until the retention tabs lock onto the rack frame to verify low-voltage backplane engagement.

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