DS200LDCCH1ALA GE Drive Control LAN Board

Availability: 10 left in stock

Configured for multi-processor motor processing and local network interface routing in Speedtronic Mark V platforms, the GE DS200LDCCH1ALA (LDCC Drive...

SKU: DS200LDCCH1ALA

Manufacturer: GE Fanuc
Product No.: DS200LDCCH1ALA
Product Type: Communication Boards
Product Origin: USA
Payment:T/T, Western Union
Weight: 1360g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Configured for multi-processor motor processing and local network interface routing in Speedtronic Mark V platforms, the GE DS200LDCCH1ALA (LDCC Drive Control/LAN Communications Board) provides direct physical/electrical execution.

Suffix Breakdown & Model Matrix

Revision Component	Designator Code	Description
Base PCB Architecture	DS200	Standard GE Mark V domestic baseline PCB layout
Functional Acronym	LDCC	Drive Control and LAN Communications Board
Group Variant	H1	High-density Group 1 circuit configuration
1st Functional Revision	A	Initial functional design revision
2nd Functional Revision	L	Secondary functional design revision
Artwork Revision	A	Base circuit trace layout and artwork revision

Hardware Specifications

Parameter	Specification
Model	DS200LDCCH1ALA
Brand	GE (General Electric)
Origin	USA
Operating Temp	0 to 60 deg C
Power Consumption	Bus-powered via internal rack assembly
Product Series	Speedtronic Mark V
PCB Protective Coating	Conformal Coating
Instruction Manual	GEI-100216
Functional Revisions	Revision 1: A, Revision 2: L, Artwork: A

Industrial Control & Processing Dynamics

The DS200LDCCH1ALA processes high-speed drive commands and external communications within Mark V control architectures. Internal microprocessors split real-time tasks between drive logic calculation and LAN network bus traffic management. The conformally coated circuit board maintains fast backplane bus communication velocity and I/O density scaling across system racks. Integrated memory locations retain operational parameters to support deterministic control and ensure long-term firmware flash compatibility.

Frequently Asked Questions

Q: What environmental protection is applied to the circuit board assembly?

A: The DS200LDCCH1ALA features a factory-applied conformal coating over the circuit traces to protect against atmospheric contaminants and moisture.

Q: How is backplane power delivered to the board?

A: Operating power is drawn directly from the internal system rack backplane via card-edge bus connectors.

Q: What technical document provides detailed installation and wiring diagrams for this module?

A: Circuit layouts, pin assignments, and operational parameters are detailed in GE instruction manual GEI-100216.

Field Installation Guidelines

Isolate all main AC and DC power supplies feeding the drive rack before inserting or removing the card.
Wear an ESD wrist strap connected to a bare cabinet metal earth ground prior to touching components.
Slide the board smoothly along the enclosure card guides until the backplane connectors fully seat into the rack socket.
Fasten all retaining screws on the front panel to maintain mechanical stability and proper chassis ground continuity.
Ensure low-voltage communication cabling is routed separately from high-voltage motor power leads to mitigate electromagnetic noise.

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