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The GE DS200TCPSG1APE, also cataloged as the DS200TCPS Power Supply Board, operates as a dedicated hardware component for DC power supply input conversion and voltage rail distribution within Speedtronic Mark V control systems.

Hardware Specifications

Parameter Specification
Model DS200TCPSG1APE
Brand General Electric
Origin USA
Weight 0.95 kg (2.09 lbs)
Dimensions Standard Mark V Board Profile
Operating Temp 0 to 60 deg C
Power Consumption Input power conversion (Internal heat dissipation < 15.0 W)
Core Function DC power supply input and voltage regulation
Assembly Type Normal Assembly
PCB Coating Normal Conformal Coating
Backward Compatibility Compatible with first two revisions (DS200TCPSG1)

Backplane Bus & Firmware Architecture

The DS200TCPSG1APE converts primary DC input power into regulated low-voltage control buses, delivering power directly to the rack backplane across multi-pin headers. Low-impedance bus trace routing minimizes voltage drop and optimizes backplane bus communication velocity during peak processing load shifts. Firmware flash compatibility is managed dynamically by the host Mark V control core processor, allowing the TCPS power board to interface without independent firmware flash flashing or field configuration updates.

Frequently Asked Questions

Q: Is the DS200TCPSG1APE backward compatible with older DS200TCPSG1 boards?

A: Yes. The DS200TCPSG1APE retains physical footprint, pinout alignment, and form-factor compatibility with the original DS200TCPSG1 base models across its first two functional revisions.

Q: Can the DS200TCPSG1APE board be hot-swapped during active core operation?

A: No. Incoming DC power lines and panel control supply must be isolated prior to removing or installing the module to prevent electrical arcing and backplane supply interruption.

Q: How does the TCPS board maintain electrical integrity during input voltage surges?

A: On-board filtering components and overvoltage protection networks stabilize the internal power rails prior to distributing low-voltage DC power across the backplane bus.

Field Installation Guidelines

  • Isolate all incoming DC feeder lines and auxiliary power supplies before removing or installing the circuit card assembly.
  • Inspect multi-pin ribbon connectors and header pins for mechanical alignment to prevent pin bending during rack insertion.
  • Ensure all retaining screws are fully tightened to the mounting standoffs to maintain proper chassis ground bonding for noise suppression.
  • Verify proper clearance around heat-dissipating components on the board surface to facilitate natural convection cooling inside the cabinet.

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