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The GE DS200LDCCG1AAA serves as the primary LDCC Drive Control/LAN Communications Board utilized to execute multi-bus signal translation and real-time motor algorithm processing across GE DIRECTO-MATIC 2000 platforms.

Hardware Specifications

Parameter Specification
Model DS200LDCCG1AAA
Brand GE (General Electric)
Origin USA
Operating Temp 0 to 60 deg C
Power Consumption Bus-powered via rack backplane
Product Series DIRECTO-MATIC 2000
Processor Locations U1 (DCP), U21 (MCP), U35 (CMP), U18 (LCP)
PCB Coating Normal Coating (G1 group variant)
Instruction Manual GEI-100216

Drive Control Architecture & Deterministic Processing

The DS200LDCCG1AAA integrates a quad-processor architecture to maintain backplane bus communication velocity and deterministic control loop execution. Peripheral I/O routines, timer operations, and A/D or D/A conversions are executed locally by the Drive Control Processor (DCP at location U1). Motor control routines and digital I/O handling are governed by the Motor Control Processor (MCP at location U21), with complex, math-intensive field-oriented vector calculations offloaded to the Co-Motor Processor (CMP at location U35). Dedicated local network interfacing is executed by the LAN Control Processor (LCP at location U18), preserving execution throughput and firmware flash compatibility across connected DIRECTO-MATIC drives.

Frequently Asked Questions

Q: What physical locations do the four onboard microprocessors occupy on the circuit board?

A: The microprocessors are arranged as follows: Drive Control Processor (DCP) at location U1, Motor Control Processor (MCP) at U21, Co-Motor Processor (CMP) at U35, and LAN Control Processor (LCP) at U18.

Q: How does the normal coating variant (G1) impact physical installation and environment compatibility?

A: The normal coating (G1) provides localized standard insulation layer thickness across the PCB trace layout; however, it lacks the full surface immersion coverage provided by fully conformally coated cards (H variants) in extreme environments.

Q: Does the board require external power supplies for processor logic execution?

A: No, operational power for the microprocessor logic array, memory PROMs, and communication interface circuits is derived directly from the rack backplane power bus.

Field Installation Guidelines

  1. Disconnect main line power to the DIRECTO-MATIC drive system and confirm zero-voltage state before opening the module rack enclosure.
  2. Wear an approved ESD grounding strap connected to the metal frame of the system enclosure prior to removing the card from its static-shielding envelope.
  3. Check hardware jumpers against project schematic drawings to match backplane address settings before rack insertion.
  4. Align the board edges with the panel guide rails and firmly press the assembly into the card cage to ensure total engagement of the backplane connectors.
  5. Terminate all incoming LAN cable shielding to the local earth ground bus using low-impedance pigtails to suppress high-frequency noise interference.

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