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The GE IC697MDL250, also cataloged as the IC697MDL250 Discrete Input Module, operates as a dedicated hardware component for 120 VAC discrete signal sensing within Series 90-70 backplane platforms.

Hardware Specifications

Parameter Specification
Model IC697MDL250
Brand GE Fanuc / Emerson Automation
Origin USA
Weight 0.75 kg (1.65 lbs)
Dimensions Standard single-slot Series 90-70 module format
Operating Temp 0 to 60 deg C
Power Consumption 1.75 W maximum (0.35 A @ 5 VDC backplane bus)
Input Points 32 points
Isolation Groups 4 isolated groups (8 points per group)
Nominal Voltage 120 VAC
Input Filter Delay 20 ms filter delay time
Current Load 0.35 A from internal 5 VDC bus

Backplane Bus Communication Velocity & I/O Processing

The module maintains synchronized input scanning across the Series 90-70 backplane bus, supporting deterministic backplane bus communication velocity during high-density signal transitions. Software configuration capabilities provide channel parameter assignment and I/O density scaling across the 32 input points, eliminating the need for physical jumpers or DIP switch settings.

Frequently Asked Questions

Q: What current load does the IC697MDL250 place on the 5 VDC backplane supply?

A: The module draws 0.35 A from the internal +5 VDC backplane power bus.

Q: What is the channel group isolation configuration on this module?

A: The 32 discrete input points are divided into 4 optically isolated groups, containing 8 points per group.

Q: What is the input filter delay response time for signal conditioning?

A: The module utilizes a standard 20 ms input filter delay time for field signal debouncing.

Field Installation Guidelines

  • Baseplate Mounting: De-energize system power before inserting the module into any available Series 90-70 baseplate slot, pressing firmly until the module backplane connectors seat fully into the bus frame.
  • AC Wiring Connections: Wire 120 VAC field inputs to the removable terminal block, ensuring each isolated group of 8 points receives its dedicated neutral and supply line connections.
  • Separation of Lines: Maintain clear physical separation between high-voltage 120 VAC input lines and low-voltage DC communication or logic cabling inside the wireway.
  • Shield Grounding: Secure field wiring cable shields and baseplate grounding studs directly to a low-impedance master enclosure ground point to prevent noise coupling.

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