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The GE Fanuc IC694MDL241, also cataloged as the IC694MDL241 Discrete Input Module, operates as a dedicated hardware component for field contact status sensing and discrete signal acquisition within PACSystems RX3i backplane networks.

Hardware Specifications

Parameter Specification
Model IC694MDL241
Brand GE Fanuc Emerson
Origin USA
Weight 0.56 lbs (0.26 kg)
Dimensions Single-slot RX3i module width
Operating Temp 0 to 60 deg C
Power Consumption 80 mA at 5 VDC and 125 mA at 24 VDC
Number of Input Points 16 discrete channels
Input Voltage Rating 24 VAC / 24 VDC
Frequency Limits 50 Hz to 60 Hz (for AC inputs)
Logic Compatibility Positive / Negative logic (sink / source)
Operating Humidity 0 to 80% non-condensing
Storage Humidity 0 to 80% non-condensing
Installation Altitude 1000 m MSL maximum

Backplane Bus Communication Velocity & I/O Density Scaling

The IC694MDL241 module optimizes backplane bus communication velocity across PACSystems RX3i backplane racks by transferring 16 discrete input states into localized CPU memory tables within every scan cycle. Scalable I/O density is achieved through the 16-point terminal interface, supporting both positive and negative logic sensing for alternating and direct current field inputs. Onboard logic circuits draw 80 mA from the internal 5 VDC backplane bus alongside 125 mA from the 24 VDC supply. Firmware flash compatibility ensures seamless address allocation during CPU rack mapping and remote I/O execution.

Frequently Asked Questions

Q: What are the backplane current requirements for the IC694MDL241 input module?

A: The module draws 80 mA from the 5 VDC backplane bus and 125 mA from the 24 VDC power supply bus.

Q: Does the IC694MDL241 support both AC and DC input signals?

A: Yes, the 16 input points accept both 24 VAC (at 50/60 Hz frequency) and 24 VDC signals in positive or negative logic configurations.

Q: What are the environmental operating and storage humidity constraints for this module?

A: The module is specified for 0 to 80% relative humidity (non-condensing) in both operating and storage conditions, at altitudes up to 1000 m MSL.

Field Installation Guidelines

  1. Disconnect backplane rack power and isolate external 24 VAC/VDC field loop circuits before inserting or removing the module.
  2. Align the module housing edge guides with the desired slot in the PACSystems RX3i baseplate and insert the unit until the rear connector seats firmly into the backplane.
  3. Fasten the top and bottom mounting tabs or screws to maintain mechanical rigidity and verify proper chassis grounding contact.
  4. Route AC/DC signal wiring to terminal blocks separate from high-voltage power leads to limit electromagnetic noise coupling.
  5. Connect input field wiring according to the intended positive or negative logic topology, ensuring compliance with the 24 VAC/VDC voltage boundaries.

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