TSXDSY32T2K Schneider Electric Discrete Output Module

TSXDSY32T2K Schneider Electric Modicon Premium Discrete Output Module

TSXDSY32T2K Schneider Electric Modicon Premium Discrete Output Module

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Schneider Electric TSXDSY32T2K Discrete Output Module Configured for high-density switching tasks in Modicon Premium and TSX Micro automation platforms, the...

رمز المنتج: TSXDSY32T2K

Manufacturer: Schneider
Product No.: TSXDSY32T2K
Product Type: Discrete Output Modules
Product Origin: France
Payment:T/T, Western Union
Weight: 310g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Schneider Electric TSXDSY32T2K Discrete Output Module

Configured for high-density switching tasks in Modicon Premium and TSX Micro automation platforms, the Schneider Electric TSXDSY32T2K (TSXDSY32T2K Discrete Output Module) provides direct physical and electrical execution. The hardware manages 32 solid-state protected discrete outputs operating at a nominal voltage of 24 VDC. Receiving control commands directly across the system backplane, the module modulates field-side actuators, indicator arrays, and interposing relay coils with a response time of 1.2 ms.

Hardware Specifications

Parameter	Specification
Model	TSXDSY32T2K
Brand	Schneider Electric
Origin	France
Weight	0.30 kg (0.66 lbs)
Dimensions	Standard module format
Operating Temp	0 to 60 deg C
Power Consumption	140 mA at 5 VDC (Bus current requirement)
Discrete Output Count	32 outputs (Solid state protected)
Discrete Output Voltage	24 VDC positive (Compliant with EN/IEC 61131-2)
Current per Channel	Less than or equal to 0.1 A
Maximum Current per Module	3.2 A
Residual Voltage	Less than 1.5 V
Response Time	1.2 ms
Output Overvoltage Protection	Transil diode
Minimum Load Impedance	220 Ohm at state 1
Electrical Connection	2 x HE-10 connectors

Backplane Bus Communication Velocity and Output Density Scaling

This Schneider Electric digital interface module organizes 32 output channels into a compact standard footprint to optimize I/O density scaling within the central equipment rack. To maintain deterministic execution speeds, the hardware synchronizes internal switching states directly with the backplane bus communication velocity. The transistor-based architecture accommodates up to three outputs wired in parallel to scale current capacities for larger inductive loads. Furthermore, an integrated isolation barrier demonstrating an isolation resistance greater than 10 MOhm at 500 V separates the internal logic bus components from field-side voltage spikes.

Frequently Asked Questions

Q: What specific protective actions take place when a field-side short-circuit occurs on an output channel?

A: The module executes an automatic trip sequence via internal protection circuitry, immediately open-circuiting the affected path to prevent thermal damage to the internal transil diode network.

Q: How do technicians determine the total thermal power dissipation of this module under full electrical load?

A: The hardware heat profile follows the baseline formula where total power dissipation equals 1.6 W plus 0.1 W multiplied by the total number of active output paths in state 1.

Q: What is the maximum allowable leakage current limit when an output channel is configured in state 0?

A: The solid-state switching components exhibit a maximum leakage current restriction of 0.1 mA when measured at an external potential of 30 VDC.

Field Installation Guidelines

Engineers must seat the standard-format chassis securely into a vacant position on the Modicon platform rack assembly. Disconnect the main backplane power distribution system completely before module insertion to avoid unintended contact degradation or logic disruptions on the data bus.

Establish external wiring connections using dual HE-10 ribbon cable connectors matched to the front-facing pins. Ensure the pre-assembled terminal cable harness locks firmly into position to maintain steady electrical continuity during vibration profiles up to 3 gn.

Provide a dedicated, reverse-polarity protected external 24 VDC power supply to energize the transistor output paths. Route the discrete output lines through independent wiring channels separate from high-power motor conductors to suppress capacitive signal coupling.

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