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Yokogawa F3SP66-4S FA-M3 Sequence CPU Module

The Yokogawa F3SP66-4S, also cataloged as the F3SP66-4S Sequence CPU Module, operates as a dedicated hardware component for high-speed sequence processing and real-time ladder logic execution within FA-M3 platforms.

Hardware Specifications

Parameter Specification
Model F3SP66-4S
Brand Yokogawa Electric Corporation
Origin Japan
Weight 200 g
Dimensions 25 x 100 x 120 mm
Operating Temp 0 to 55 deg C
Power Consumption Base unit backplane supplied
Instruction Execution Speed 0.00375 us per basic instruction
Program Capacity Up to 120K steps (1 MB user program)
Memory Type Battery-backed RAM with SD card extension slot
Communication Ports Ethernet (10BASE-T/100BASE-TX), RS-232C, RS-485
Max I/O Handling Up to 2,048 points

4-20 mA HART Loop Protocol & Channel-to-Channel Isolation

The F3SP66-4S processing core manages complex control loops by transferring high-density I/O values across the FA-M3 backplane bus. Internal bus coupling circuits provide complete electrical galvanic isolation between main CPU memory registers and peripheral field cards. When processing analog field signals routed through 4-20 mA HART loop protocol interface modules, the CPU relies on physical channel-to-channel isolation on the I/O layer to eliminate ground loop voltage spikes, preventing noise interference from altering memory registers or corrupting serial/Ethernet transmission frames.

Frequently Asked Questions

Q: How does the SD card slot function alongside the internal battery-backed RAM?

A: The onboard battery-backed RAM retains active program logic and system data registers during power down, while the integrated SD card slot serves as secondary non-volatile storage for program backup, firmware flashing, and operational log file archiving.

Q: Can the F3SP66-4S CPU module be inserted or removed while the main base rack is powered?

A: No. The F3SP66-4S requires complete de-energization of the FA-M3 base unit power supply prior to module insertion or extraction to prevent backplane bus damage or corrupted system memory states.

Field Installation Guidelines

Align the F3SP66-4S module guide rails with the designated CPU slot on the FA-M3 base rack and push firmly until the top and bottom retention latches snap securely into position. Maintain a low-impedance connection between the base rack grounding terminal and cabinet earth ground using minimum 2.0 mm2 wire to prevent electrostatic build-up. Route serial and Ethernet communication cables in dedicated wire raceways separated from 230 VAC power and high-current inductive motor wiring to ensure signal integrity across the RS-232C, RS-485, and RJ45 network links.

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