100% Genuine. 100,000+ Parts in Stock. Ready to Ship.

  • en

The GE DS200TCDAG1A, also cataloged as the DS200TCDA Digital I/O Board, operates as a dedicated hardware component for digital contact signal conditioning and IONET serial communication execution within GE Mark V LM platforms.

Hardware Specifications

Parameter Specification
Model DS200TCDAG1A
Brand GE General Electric
Origin USA
Weight Standard Mark V PCB weight
Dimensions Standard Mark V core slot assembly
Operating Temp 0 to 60 deg C
Power Consumption System logic bus powered
Product Series Mark V LM
Functional Acronym TCDA
Functional Revision Revision A
Instruction Manual GEH-6153
Core Locations Q11, Q21, Q51 (Digital I/O Cores)
Interface Compatibility TCRA, DTBA, DTBB, TCQC, CTBA
Bus Architecture IONET Serial Communication Network

Backplane Bus & Network I/O Specifications

The board relies on dedicated IONET backplane bus communication velocity to link digital I/O engines across core locations Q11, Q21, and Q51. Contact output signals from dual TCRA modules alongside digital contact inputs originating at DTBA and DTBB terminal boards route through TCDA circuitry for signal normalization. Physical network links extend through CTBA in core R5 and TCQC in cores R1 and R2 over deterministically addressed packet routing, ensuring targeted I/O density scaling and maintaining firmware flash compatibility across the Mark V LM processing architecture.

Frequently Asked Questions

Q: Which hardware cores house the DS200TCDAG1A board inside the cabinet?

A: The board installs directly into digital I/O cores designated as Q11, Q21, or Q51 within the Mark V LM control chassis.

Q: How are digital input and output signals routed to and from the TCDA card?

A: Contact output signals from TCRA boards and discrete contact inputs from DTBA/DTBB terminal boards enter the TCDA, which processes and distributes them over IONET to TCQC and CTBA modules.

Q: How does the IONET bus manage data transmission across multiple TCDA boards?

A: IONET operates as an address-specific serial network, ensuring data packets are routed exclusively to targeted board addresses without network collision across digital cores.

Field Installation Guidelines

  1. System De-energization: Lock out all main power feeds to the turbine control cabinet before removing or seating any digital I/O PCB modules.
  2. ESD Handling Safeguards: Attach a grounded wrist strap to the bare metal frame of the Mark V enclosure to prevent electrostatic damage to logic circuitry during handling.
  3. Connector Alignment: Align card-edge connectors with core backplane slots Q11, Q21, or Q51 before applying firm, even pressure to prevent pin bending.
  4. Cable Routing: Verify serial IONET cable links between CTBA/TCQC modules and the TCDA board are securely fastened and routed clear of high-voltage field wiring.

What's clients say about us

Translation missing: en.general.search.loading