SCHNEIDER ELECTRIC TSXSUP702 Power Supply Module
Configured for high-capacity power distribution in Modicon TSX Micro platforms, the SCHNEIDER ELECTRIC TSXSUP702 (TSXSUP702 Power Unit) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | TSXSUP702 |
| Brand | Schneider Electric |
| Origin | Manufacturer specified |
| Weight | 2.6 kg |
| Dimensions | 80 x 230 x 230 mm |
| Operating Temp | Industrial standard compliant |
| Power Consumption | 70 W (Total output) |
| Input Voltage | 100-240 VAC (Auto-ranging) |
| Protection | Internal fuse, short-circuit, overload |
Backplane Bus and I/O Density Scaling
The TSXSUP702 maintains stable backplane bus communication velocity by providing regulated DC voltages to the CPU and associated I/O modules. The internal architecture is optimized to support high-density configurations, ensuring that transient current demands from motion control and high-speed counter modules do not induce voltage droop. By decoupling the primary AC mains from the logic circuitry, the module facilitates reliable operation in environments with significant grid instability. Firmware flash compatibility and diagnostic monitoring circuits allow the TSX Micro processor to detect power health status, ensuring deterministic I/O scan cycles are maintained across the entire backplane assembly.
Frequently Asked Questions
Q: Can the TSXSUP702 be utilized in configurations exceeding 70W load?
A: No. The total power draw from all modules mounted to the TSX Micro rack, including the CPU and all I/O cards, must remain below the 70W threshold. Exceeding this limit will trigger internal protection circuits, resulting in a system power-off.
Q: How does the unit protect against input line surges?
A: The module incorporates integrated suppression circuitry designed to clamp transient voltage spikes. Ensure that the module is properly connected to a stable protective earth (PE) ground to allow these suppression circuits to function as intended during an overvoltage event.
Field Installation Guidelines
- Mounting: Secure the TSXSUP702 to the TSX Micro rack assembly. Ensure adequate clearance around the unit to allow for passive convection cooling, as proper airflow is necessary for the integrated heat dissipation profiles to maintain the 70W rating.
- Wiring: Connect the 100-240 VAC source to the primary input terminal block. Use adequately gauged copper conductors to minimize voltage drop between the source and the module.
- Verification: Prior to connecting the backplane to the CPU, verify the DC output voltage at the secondary terminals to confirm nominal regulation. Monitor the front-panel LED indicators post-startup to confirm both the AC input and DC output stages are operating within design limits.
What's clients say about us
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Finding brand new, original modules is critical for our safety. This team delivers factory-fresh components with full certification. Their commitment to only selling new products makes them our most trusted partner.
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Engineering Lead, GermanyTop-tier Service and Quality
We have sourced Honeywell and Schneider parts here for two years. Every shipment arrives well-packaged with original factory seals intact. Clear communication and the best lead times in the industry.
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Operations Director, GermanyRelated Products
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Guide
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