100% Genuine. 100,000+ Parts in Stock. Ready to Ship.

  • en

GE Fanuc VMIVME-7768 VME Single Board Computer

Configured for high-speed data handling and real-time computation in distributed VME networks, the GE Fanuc VMIVME-7768 (VMIVME-7768 Single Board Computer) provides direct physical and electrical execution. The module interfaces directly with a standard 6U VME64 backplane to handle dense processing workloads without external active cooling systems in standard configurations.

Hardware Specifications

Parameter Specification
Model VMIVME-7768
Brand GE Fanuc / VMIC
Origin USA
Form Factor 6U VME (Single-slot)
Processor Intel Pentium M (1.6 GHz or 1.8 GHz variants)
L2 Cache 1 MB or 2 MB (on-die)
Memory Up to 1 GB DDR SDRAM with ECC
VME Interface Tundra Universe II bridge; Full VME64 Compliance
Addressing A32/D32, A24/D16, A16/D8(EO)
Ethernet Dual 10/100/1000 Mbps Gigabit Ethernet ports (Intel 82546EB)
Expansion Dual PMC slots (IEEE 1386.1)
Onboard Storage IDE Flash (up to 512 MB) and CompactFlash Type I/II socket
Serial I/O Two 16550-compatible RS-232/422/485 serial ports
USB Support Dual USB 2.0 ports (front panel)
Video Integrated SVGA Controller
Operating Temp 0 to +55 deg C (Standard Air-Cooled)
Weight 0.45 kg (Typical configuration)
Power Consumption 25 W (Typical depending on processor speed and memory load)
Dimensions Standard 6U VME form factor

Industrial Control and Backplane Technology

The VMIVME-7768 utilizes the Tundra Universe II VME-to-PCI bridge to achieve steady backplane bus communication velocity across the VME64 infrastructure. The integration of high-performance architecture permits deterministic processing schedules over local subnets, preventing data collisions during concurrent DMA transfers.

The onboard firmware flash compatibility ensures that the core BIOS can handle real-time operating system (RTOS) kernels such as VxWorks or QNX without boot latency. Furthermore, the dual PMC expansion slots enable deterministic localized I/O density scaling via mezzanine cards without expanding the physical footprint on the backplane rack.

Frequently Asked Questions

Q: Does the VMIVME-7768 support hot-swap insertion into a live VME backplane? A: No. The VME64 specification implemented on this module requires a complete system power-down prior to extraction or insertion. Live insertion can cause permanent electrical damage to the Tundra Universe II bridge and host backplane drivers.

Q: How does the Error Correcting Code (ECC) memory handle single-bit errors? A: The onboard DDR SDRAM circuitry automatically detects and corrects single-bit memory faults in real-time at the hardware level. Multi-bit faults are caught and trigger a non-maskable interrupt (NMI) to enforce a safe-stop sequence, preventing corrupt data execution.

Q: Can the onboard serial ports be reconfigured without hardware jumpers? A: The physical routing for RS-232, RS-422, or RS-485 modes requires proper adjustment of onboard jumper blocks as specified in the hardware manual. Software register configurations alone will not isolate the electrical lines for differential signaling modes.

Field Installation Guidelines

  • Handling and ESD Control: The module contains highly sensitive CMOS components. Installers must use a grounded static-dissipative wrist strap connected to the chassis ground before removing the board from its anti-static packaging.
  • Backplane Alignment and Insertion: Ensure that the chassis power supply is completely switched off. Align the top and bottom edge-guides of the module with the card cage slots. Gently slide the module inward until the DIN connectors make initial contact with the backplane. Use the front-panel injector/ejector handles to fully seat the module pins into the VME64 slots.
  • Fastener Torque Requirements: Tighten the front-panel retaining screws to a torque specification of 0.23 N-m (2.0 in-lbs) to maintain chassis electrical continuity and mechanical stability under high-vibration scenarios.
  • Airflow Clearance: Maintain a minimum space clearance of 10 mm above and below the card cage to sustain continuous convective heat dissipation across the localized heatsinks within the 0 to +55 deg C envelope.

What's clients say about us

Translation missing: en.general.search.loading