MX3*D Yokogawa Digital I/O Module | New & Original Stock

32-Channel Digital I/O Card | Yokogawa MX3*D CS 3000

32-Channel Digital I/O Card | Yokogawa MX3*D CS 3000

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Yokogawa MX3*D Digital I/O Module The Yokogawa MX3*D, also cataloged as the MX3 Digital I/O Card, operates as a dedicated...

رمز المنتج: MX3*D

Manufacturer: Yokogawa
Product No.: MX3*D
Product Type: Digital I/O Cards
Product Origin: JAPAN
Payment:T/T, Western Union
Weight: 350g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

Yokogawa MX3*D Digital I/O Module

The Yokogawa MX3*D, also cataloged as the MX3 Digital I/O Card, operates as a dedicated hardware component for discrete input and output signal processing within CENTUM VP and CS 3000 networks. The hardware interfaces directly with field switches, interlock relays, and solenoid loops, converting high-density external state variations into structured status arrays for transmission across the system backplane bus.

Hardware Specifications

Parameter	Specification
Model	MX3*D
Brand	Yokogawa
Origin	USA
Weight	0.35 kg (module weight) / 0.6 kg (with packaging configuration)
Dimensions	120 mm x 25 mm x 130 mm (card size)
Operating Temp	0 to 60 deg C
Power Consumption	6.0 W (calculated from 5 VDC, 1.2 A backplane draw)
System Compatibility	CENTUM VP, CS 3000
Channels	32 digital I/O channels
Signal Type	Discrete ON/OFF (24 VDC nominal)
Input Voltage Range	18 to 30 VDC
Output Current	Up to 0.5 A per channel
Isolation	1500 VAC (channel-to-system, 1 min)
Humidity Range	5 to 95% RH (non-condensing)

Channel-to-Channel Isolation & Process Interface

The discrete card processes 32 high-density digital I/O channels configured for nominal 24 VDC industrial loops. To intercept common-mode transient voltage spikes from reaching the core system processors, the module maintains an onboard galvanic isolation barrier rated at 1500 VAC between the field terminal side and the system logic interface. Individual field outputs support a continuous driving capacity up to 0.5 A per channel, deploying automatic overcurrent dampening thresholds to protect the internal silicon switches from inductive voltage kickback during valve or relay de-energization. Front-panel diagnostic indicators map specific states directly, utilizing physical LEDs to indicate discrete channel ON/OFF conditions and active circuit faults.

Frequently Asked Questions

Q: How does the MX3*D respond to an overcurrent condition on a single digital output channel?

A: The card incorporates autonomous electronic current limiting for each individual output path. When a connected solenoid or external load exceeds the 0.5 A allocation, the localized channel circuit clamps the current to prevent internal thermal degradation, illuminating the front-panel fault indicator without affecting the logic execution of adjacent channels.

Q: Does the module support online extraction and replacement during active dual-redundant execution?

A: Yes, when deployed in a paired dual-redundant configuration within the slot framework, the backup architecture permits full hot-swap operations. Removing an active module shifts the discrete I/O polling sequence to the parallel card within less than one system scan cycle, preventing signal drops to critical field safety loops.

Field Installation Guidelines

Subrack Engagement Sequence: Slide the I/O card along the designated vertical guide slots within the field control unit (FCU) chassis assembly. Verify that the alignment tabs seat perfectly into the rear backplane receptacle before pivoting the extraction levers to secure the module pins into the active multi-pin connector block.
External Signal Shielding: Route all 24 VDC discrete signal paths through dedicated field wiring ducts separate from primary AC distribution lines. Terminate all multi-pair cable shields at the single instrument ground plane bar located inside the marshalling cabinet enclosure to inhibit external inductive noise propagation.
Enclosure Thermal Maintenance: Maintain uniform convective air patterns beneath the chassis card space. Ensure that total cumulative module current demands do not force the localized ambient microclimate above the 60 deg C operational limits, preventing rapid thermal stress on the electronic solid-state switches.

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