GE Fanuc IC695CPK330 PACSystem RX3i Processor Module

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The GE IC695CPK330, also cataloged as the IC695CPK330 CPU module, operates as a dedicated hardware component for high-speed logic execution...

رمز المنتج: IC695CPK330

Manufacturer: GE Fanuc
Product No.: IC695CPK330
Product Type: CPU Processors
Product Origin: USA
Payment:T/T, Western Union
Weight: 2240g
Shipping port: Xiamen
Warranty: 12 months

وصف التقييمات

The GE IC695CPK330, also cataloged as the IC695CPK330 CPU module, operates as a dedicated hardware component for high-speed logic execution and multi-protocol network orchestration within PACSystem RX3i platforms.

Hardware Specifications

Parameter	Specification
Model	IC695CPK330
Brand	GE Fanuc Emerson
Origin	USA / Global Manufacturing
Weight	2.24 kg (4.94 lbs)
Dimensions	Dual-Slot PACSystem RX3i Form Factor
Operating Temp	0 to 60 deg C
Power Consumption	3.3 A at 5 VDC
Series	PACSystem RX3i
Product Type	CPU Processors
Processor Clock Speed	1 GHz / 1.6 GHz
Memory Capacity	64 MB RAM, 64 MB Non-Volatile Memory
Memory Card Slot	1 CFast (Very High Speed CompactFlash)
Backplane Rack Occupancy	2 Slots
Local Rack Capacity	Up to 8 local racks
USB Interface	1 USB-A 2.0 interface
Ethernet Interface	3 Ethernet ports (1 x 10/100/1000 Mbps port, 2 x 10/100/1000 Mbps embedded switch ports)
Ethernet Protocols	SRTP Client/Server, Modbus TCP/IP, OPC-UA Server, EGD, PROFINET
Communication Protocols	DNP3 Outstation, HART Pass-Thru, SNP, IEC 104, IEC 61850 Client
I/O Protocols	Modbus RTU, Profibus, Modbus TCP, DeviceNet, Genius, EGD, Reflective Memory
Power Fault Protection	Energy Pack compatible for memory retention

Backplane Bus Communication Velocity and System Integration

The IC695CPK330 processes control algorithms and interfaces directly with the high-speed RX3i PCI backplane bus to optimize backplane bus communication velocity across up to 8 local racks. Internal dual-slot processing architecture executes ladder logic, structured text, and function block diagram tasks while simultaneously managing PROFINET and OPC-UA Server network queues without compromising control cycle timing.

Firmware flash compatibility ensures continuous field protocol enhancements and software synchronization via Machine Edition Logic Developer PLC 8.6 SIM8 or later. Built-in 2-port Gigabit Ethernet switching functionality enables linear, ring, and star topologies, supporting high-density I/O density scaling and redundant hot-standby system configurations across deterministic control networks.

Frequently Asked Questions

Q: How does the IC695CPK330 retain user application programs during a power failure?

A: The module utilizes Energy Pack technology, which provides transient power during supply outages to write RAM contents directly to the onboard 64 MB non-volatile memory.

Q: How many backplane slots does the IC695CPK330 CPU occupy in an RX3i main rack?

A: The processor module occupies two adjacent backplane slots on the RX3i system rack.

Q: What physical network configurations are supported by the onboard Ethernet switch ports?

A: The two embedded 10/100/1000 Mbps switch ports support linear, star, and ring network topologies using standard RJ45 shielded connections.

Field Installation Guidelines

Verify backplane power is completely isolated before inserting or removing the module from the two assigned RX3i rack slots.
Fully seat the processor backplane connectors and tighten retaining screws to maintain mechanical chassis grounding and thermal contact.
Connect external Ethernet communications using Category 5e or Category 6 shielded twisted-pair cables with grounded RJ45 connectors.
Install an optional Energy Pack capacitor module according to manufacturer pin alignment to ensure proper volatile memory flush upon main power loss.
Maintain minimum panel clearances above and below the module backplane assembly to allow convective cooling between 0 and 60 deg C.

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