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The General Electric DS200TCCBG1B, also cataloged as the DS200TCCB Analog I/O Board, operates as a dedicated hardware component for analog input and output signal processing within Mark V Speedtronic Turbine Control System platforms.

Hardware Specifications

Parameter Specification
Model DS200TCCBG1B
Brand General Electric
Origin USA
Weight Standard PCB weight (~0.50 kg / 1.1 lbs)
Operating Temp 0 to 60 deg C
Power Consumption Standard backplane power rail draw
Series Mark V
Functional Acronym TCCB
Functional Revision Revision B
PCB Coating Normal Coating
Signal Processing Multi-channel analog-to-digital (A/D) and digital-to-analog (D/A) signal conversion
Onboard Memory Socketed EPROM / PROM IC arrays for firmware execution
Interconnects High-density multi-pin ribbon connectors and backplane edge connectors
Hardware Configuration Hardware jumper arrays for channel scaling and ground selection

Deterministic Network & Backplane Integration

Designed for seamless integration into the Speedtronic Mark V Triple Modular Redundant (TMR) architecture, the board conditions analog sensor feedback and converts field values into digital signals across the system backplane. Channel-to-channel signal paths maintain strict electrical isolation to eliminate cross-talk and prevent noise propagation into deterministic control loops. Onboard firmware flash compatibility ensures synchronized processing cycles across redundant core processors ($\text{R}$, $\text{S}$, and $\text{T}$).

Frequently Asked Questions

Q: Can the DS200TCCBG1B board be hot-swapped while the Mark V rack is fully powered?

A: No, power to the local rack and associated I/O bus section must be isolated before removing or inserting the module to prevent electrical arcs and processor bus faults.

Q: What step must be taken regarding jumpers when replacing a DS200TCCBG1B in the field?

A: All hardware jumper positions on the replacement board must be manually audited and configured to match the exact physical positions of the original board being replaced.

Q: What onboard memory components are present on the DS200TCCBG1B?

A: The module contains socketed EPROM/PROM integrated circuits that store board-level execution firmware and signal scaling routines.

Field Installation Guidelines

  1. ESD Safety Precautions: Ensure all technicians wear a grounded ESD wrist strap before removing the board from its anti-static protective enclosure.
  2. System De-energization: Confirm that power supplies to the specific Mark V card cage section are completely disconnected prior to card insertion.
  3. Card Alignment: Align the PCB edges with the card guide rails inside the rack chassis and push firmly until the backplane connectors fully seat.
  4. Cable Termination: Attach all ribbon cable headers securely, ensuring lock latches engage cleanly to maintain low-resistance contact.
  5. Grounding & Shielding: Verify that field cable shields are grounded at the designated ground bar to minimize electromagnetic interference on sensitive analog channels.

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