The General Electric DS200TCCBG1B, also cataloged as the DS200TCCB Analog I/O Board, operates as a dedicated hardware component for analog input and output signal processing within Mark V Speedtronic Turbine Control System platforms.
| Parameter | Specification |
|---|---|
| Model | DS200TCCBG1B |
| Brand | General Electric |
| Origin | USA |
| Weight | Standard PCB weight (~0.50 kg / 1.1 lbs) |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Standard backplane power rail draw |
| Series | Mark V |
| Functional Acronym | TCCB |
| Functional Revision | Revision B |
| PCB Coating | Normal Coating |
| Signal Processing | Multi-channel analog-to-digital (A/D) and digital-to-analog (D/A) signal conversion |
| Onboard Memory | Socketed EPROM / PROM IC arrays for firmware execution |
| Interconnects | High-density multi-pin ribbon connectors and backplane edge connectors |
| Hardware Configuration | Hardware jumper arrays for channel scaling and ground selection |
Designed for seamless integration into the Speedtronic Mark V Triple Modular Redundant (TMR) architecture, the board conditions analog sensor feedback and converts field values into digital signals across the system backplane. Channel-to-channel signal paths maintain strict electrical isolation to eliminate cross-talk and prevent noise propagation into deterministic control loops. Onboard firmware flash compatibility ensures synchronized processing cycles across redundant core processors ($\text{R}$, $\text{S}$, and $\text{T}$).
Q: Can the DS200TCCBG1B board be hot-swapped while the Mark V rack is fully powered?
A: No, power to the local rack and associated I/O bus section must be isolated before removing or inserting the module to prevent electrical arcs and processor bus faults.
Q: What step must be taken regarding jumpers when replacing a DS200TCCBG1B in the field?
A: All hardware jumper positions on the replacement board must be manually audited and configured to match the exact physical positions of the original board being replaced.
Q: What onboard memory components are present on the DS200TCCBG1B?
A: The module contains socketed EPROM/PROM integrated circuits that store board-level execution firmware and signal scaling routines.
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