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The GE Fanuc DS200SDCCG1AHD, also cataloged as the DS200SDCC Drive Control Card, operates as a dedicated hardware component for primary drive processing and motor control execution within Mark V Speedtronic platforms.

Hardware Specifications

Parameter Specification
Model DS200SDCCG1AHD
Brand GE Fanuc
Origin USA
Operating Temp 0 to 60 deg C
Power Consumption Power Supplied via Backplane
Onboard Processors 3 Microprocessors (1 Drive Control, 2 Motor Control including Math Accelerator)
Onboard Memory Dual-Port RAM for Concurrent Processor Access
Coating Style Normal Protective PCB Coating
Manual Reference GEI-100029
Revisions Group 1, Functional Rev A/H, Artwork Rev D

Backplane Bus Communication & Firmware Compatibility

The GE Fanuc DS200SDCCG1AHD serves as the central processing node on the Mark V control backplane. High backplane bus communication velocity is sustained by offloading tasks across its three microprocessors, where dual-port RAM allows simultaneous reads/writes without CPU wait-states. Real-time motor parameters and drive execution routines run deterministically across internal busses. Full firmware flash compatibility is maintained during parameters download or upload via an optional LAN communications card attached to the base assembly.

Frequently Asked Questions

Q: How does the triple-microprocessor architecture process drive execution?

A: One microprocessor handles overall drive control tasks, while the remaining two dedicate processing capacity to motor control loops, with one specifically assigned to high-speed math-intensive calculations.

Q: How is configuration data transferred to or from the DS200SDCCG1AHD card?

A: A laptop connects via a serial cable to an optional LAN communications card mounted on the SDCC card, allowing software configuration files to be edited, uploaded, or cloned across identical drive controllers.

Q: What precautions should be taken when disconnecting the serial programming cable?

A: Drive input power must be completely turned off prior to cable removal to prevent accidental contact with high-voltage circuits inside the drive enclosure.

Field Installation Guidelines

  1. Power Isolation: Fully de-energize the drive enclosure and execute lockout/tagout procedures before inserting or removing the card.
  2. ESD Grounding: Technicians must wear an ESD wrist strap grounded to the drive chassis during installation to prevent electrostatic damage to the microprocessors and RAM ICs.
  3. Card Alignment: Align the card along the rack guides and press firmly to seat backplane edge connectors without applying uneven pressure.
  4. Serial Interface Configuration: When attaching auxiliary LAN expansion cards, ensure header pins line up correctly and cable connectors are fully latched before applying power.

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