DS200SDCCG4A GE Drive Control Card Mark V

General Electric DS200SDCCG4A Mark V Drive Control Card

General Electric DS200SDCCG4A Mark V Drive Control Card

Availability: 10 left in stock

The General Electric DS200SDCCG4A, also cataloged as the DS200SDCC Drive Control Card, serves as the primary controller board utilized to...

SKU: DS200SDCCG4A

Manufacturer: General Electric
Product No.: DS200SDCCG4A
Product Type: Drive Control Boards
Product Origin: China
Payment:T/T, Western Union
Weight: 850g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

The General Electric DS200SDCCG4A, also cataloged as the DS200SDCC Drive Control Card, serves as the primary controller board utilized to execute core processing and drive regulation tasks across Mark V Speedtronic Turbine Control System platforms.

Hardware Specifications

Parameter	Specification
Model	DS200SDCCG4A
Brand	General Electric
Origin	USA (Salem, Virginia)
Weight	Standard PCB weight (~0.85 kg / 1.87 lbs)
Operating Temp	0 to 60 deg C
Power Consumption	Standard backplane control chassis power draw
Series	Mark V
Functional Acronym	SDCC
Functional Revision	Revision A
PCB Coating	Normal Coating
Processor Architecture	3 onboard microprocessors
Memory Allocation	Multi-processor accessible RAM, 5 socketed EPROM chips (4 factory-defined, 1 site-specific)
Instruction Manual	GEI-100029
Product Grouping	Group 4 Mark V Series

Deterministic Network & Firmware Execution

Operating as the primary computational engine for the automated drive assembly, the module manages multi-processor memory cycling across shared RAM sectors to execute deterministic backplane communication. Firmware flash compatibility is strictly bound to the physical, socketed EPROM arrays. The dedicated microprocessors scale I/O densities across the drive chassis while parsing site-specific logic loaded into the dedicated user EPROM, ensuring precise actuator loop feedback response and deterministic communication velocity across connected Speedtronic nodes.

Frequently Asked Questions

Q: How is the firmware and site-specific configuration transferred when replacing a defective DS200SDCCG4A board?

A: The five socketed EPROM chips (four containing factory files and one containing site-specific configuration) must be physically removed from the defective board and installed onto the replacement board.

Q: What memory architecture allows the DS200SDCCG4A to process logic from its multiple onboard microprocessors?

A: The board utilizes a shared RAM architecture that permits simultaneous data access and cycling by all three onboard microprocessors.

Q: Can the EPROM chips on the DS200SDCCG4A be damaged by static discharge during transfer?

A: Yes, the socketed EPROMs are highly sensitive to electrostatic discharge (ESD). A grounded wrist strap must be worn during the physical transfer to prevent memory corruption.

Field Installation Guidelines

Static Protection (ESD): Technicians must wear a grounded ESD wrist strap connected to a bare metal rack ground or workbench grounding plug before handling the board or its EPROM chips.
Power Isolation: Confirm all chassis power supplies are completely de-energized before removing the primary drive control card to prevent backplane logic faults.
EPROM Transfer: Using a specialized IC extraction tool, carefully pull the 5 EPROM chips from the original board. Verify correct pin alignment and directional notch orientation when seating them into the new DS200SDCCG4A board.
Card Insertion: Slide the PCB into the designated card cage slot, applying even pressure to seat the rear edge connectors firmly into the system backplane.
Storage Precautions: Keep both the replacement and defective boards inside static-shielding bags whenever they are not installed in the grounded drive chassis.

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