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The General Electric DS3800HMPJ1A1D, also cataloged as the DS3800HMPJ Microprocessor Board, operates as a dedicated hardware component for localized processing and execution tasks within Mark IV Speedtronic Turbine Control System platforms.

Suffix Breakdown & Model Matrix

Part Segment Structural / Functional Coding
DS3800 Domestic manufacture location; Mark IV Series Group 1 product class
HMPJ Functional board acronym designation
1 Design revision / assembly iteration level 1
A1D Artwork version and consecutive engineering revision state

Hardware Specifications

Parameter Specification
Model DS3800HMPJ1A1D
Brand General Electric
Origin USA (Domestic)
Weight Standard PCB weight (~0.45 kg / 1.0 lb)
Dimensions Standard Mark IV full-height circuit board profile
Operating Temp 0 to 60 deg C
Power Consumption Standard backplane VME bus power requirements
Series Mark IV Speedtronic
Board Functional Acronym HMPJ
Assembly Type Normal Assembly
Processor Architecture Dedicated onboard microprocessor with 50+ integrated circuits
Memory Components Onboard socketed PROM / EPROM IC arrays
Interface Connectors Edge backplane card-edge connector, onboard vertical pin connector, cable header
Expansion Capability 4-standoff mounting footprint for piggyback daughterboard installation
User Interfaces 2 Status LEDs (1 Red, 1 Yellow), jumper switch arrays, test points
Mechanical Mounting Dual PCB retention clips for VME rack insertion, insulated factory-drilled mounting holes

Backplane Bus Communication & Hardware Execution

Configured to interface with the Mark IV Speedtronic Triple Modular Redundant (TMR) architecture, the board exchanges critical processing metrics via high-velocity backplane bus communication protocols. The onboard processor coordinates local memory cycles across socketed EPROM/PROM arrays while maintaining firmware flash compatibility across systemic revision states. Integrated signal paths feature dedicated hardware test points to evaluate real-time logic states without disrupting deterministic bus execution.

Frequently Asked Questions

Q: How is the daughterboard interface mechanically secured and electrically coupled to the DS3800HMPJ1A1D?

A: Secondary daughterboards mount directly onto four surface standoffs and communicate via the primary board's vertical pin and cable connector assembly.

Q: What installation feature prevents static damage or ground loops when mounting the board chassis?

A: All factory-drilled base mounting holes are ringed with specialized insulating material to isolate surface voltages and prevent ground potential transfer.

Q: Do jumper switches require configuration during field replacement?

A: Yes, onboard jumper switches set physical hardware operating modes and must be configured to match the hardware profile of the original board being replaced.

Field Installation Guidelines

  1. Electrostatic Discharge (ESD) Protection: Wear a grounded ESD wrist strap connected to cabinet earth ground prior to handling the unshielded circuit board.
  2. Rack Insertion: Align the printed circuit board edges with the standard VME rack card guides inside the Mark IV enclosure. Slide the unit inward until the rear edge-connector interfaces securely with the backplane bus.
  3. Retention Lock: Engage the two right-hand retention clips onto the rack mounting frame to secure the module against vibration.
  4. Daughterboard Mounting: Ensure all standoffs and pin connectors are fully seated and free from bent pins before applying power.
  5. Jumper Verification: Verify that all jumper switches match the field specification drawing or the existing hardware configuration before powering the system backplane.

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