The Honeywell FC-IOCHAS-0001S, also cataloged as the FC-IOCHAS-0001S I/O Chassis Assembly (Non-Redundant), operates as a dedicated hardware component for mechanical housing and backplane signal distribution within Honeywell Experion PKS and C300 platforms. It houses single non-redundant Series C I/O modules, routing power and communications directly through the embedded backplane trace architecture to connected termination assemblies without external jumper cables.
| Parameter | Specification |
|---|---|
| Model | FC-IOCHAS-0001S |
| Brand | Honeywell |
| Origin | USA |
| Weight | 0.66 kg to 0.90 kg |
| Dimensions | 180 mm x 100 mm x 25 mm |
| Operating Temp | 0 deg C to +60 deg C (32 deg F to 140 deg F) |
| Power Consumption | Passive Backplane (Sourced via I/O Carrier Power) |
| System Compatibility | Honeywell Experion PKS, C300 Controllers |
| Subsystem Type | Non-Redundant I/O Module Housing |
| Material | Corrosion-resistant industrial composite / metal alloy |
| Field Termination | High-density backplane connectors; screw-terminal field wiring |
| Certifications | CE, UL, CSA, RoHS Industrial Compliance |
The internal backplane circuitry incorporates galvanically isolated signal traces to maintain channel-to-channel isolation between adjacent I/O modules and downstream termination assemblies. This electrical separation suppresses common-mode noise and ground loop currents across analog and digital channels. In addition, the trace impedance is engineered to pass high-frequency digital communications alongside standard analog signals, maintaining full compliance with 4-20 mA HART loop protocol standards without attenuation or signal distortion.
Q: Can a redundant I/O module pair be installed in the FC-IOCHAS-0001S?
A: No. The internal backplane of the FC-IOCHAS-0001S lacks the secondary bus traces and switchover logic lines required for dual-redundant module communication. Redundant configurations require a redundant carrier assembly.
Q: Can an FC-CPCHAS control processor chassis be substituted with an FC-IOCHAS-0001S?
A: No. The physical connector keying, internal power distribution planes, and backplane pin assignments differ between processor bases and I/O housings, preventing cross-compatibility.
Q: Is module replacement supported while field wiring remains powered?
A: Yes. Field wiring terminates at the chassis base assembly or associated termination block. Technicians can perform warm-swapping of individual electronic I/O modules without loosening terminal screws or disturbing field cables.
Mount the chassis onto standard Honeywell Series C mounting channels or DIN rails, ensuring all retention clamps latch to prevent motion under mechanical vibration. Run field signal cables through dedicated wire ducts, keeping high-voltage power lines physically separated to eliminate inductive coupling. Ground the metal chassis frame directly to the cabinet functional earth bar using a low-impedance conductor to guarantee electromagnetic compatibility (EMC).
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