The Yokogawa YCB301-C500, also cataloged as the YCB301 ESB Bus Communication Cable, operates as a dedicated hardware component for high-integrity serial data transmission within Yokogawa CENTUM VP control platforms.
| Parameter | Specification |
|---|---|
| Model | YCB301-C500 |
| Brand | Yokogawa |
| Origin | Japan |
| Weight | 0.10 kg |
| Dimensions | 500 m length |
| Operating Temp | -20 to +70 deg C |
| Power Consumption | Passive physical media |
| Network Protocol | ESB Bus (Extended System Bus) |
| Conductor Material | High-purity copper |
| Shielding | Overall EMI/RFI braid shield |
| Connection Method | Solderless lugs with M4 screws / ESB bus connectors |
| Bending Radius | Minimum 100 mm |
The YCB301-C500 cable maintains continuous physical layer connectivity between central processor units and remote expansion I/O node units over Extended System Bus networks. High-density braided shield construction mitigates electro-magnetic noise coupling, preventing network packet loss across extended cable runs. Galvanic isolation across connected bus interfaces prevents stray ground loop currents from propagating between remote node racks. Furthermore, balanced copper conductors provide low signal attenuation, ensuring precise transit of digital telemetry and 4-20 mA HART loop protocol data streams pass through connected I/O units without signal degradation.
Q: Can installation personnel route the YCB301-C500 cable through outdoor conduit paths?
A: Yes, the rugged jacket construction supports both indoor and outdoor conduit routing provided ambient temperatures remain between -20 and +70 deg C.
Q: How does proper shield termination affect communication reliability across the ESB bus?
A: Grounding the overall cable shield braid to the master functional earth bar at designated termination points redirects coupled high-frequency electrical noise to ground, keeping the differential data lines clean.
Q: Does bending the cable sharper than the specified 100 mm minimum bend radius cause permanent transmission errors?
A: Bending the assembly tighter than the 100 mm threshold alters conductor spacing and internal foil geometry, creating characteristic impedance mismatches that reflect data pulses and cause signal degradation.
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