The Allen-Bradley 1746-OB16/D, also cataloged as the 1746-OB16 Output Module, operates as a dedicated hardware component for discrete current-sourcing execution within SLC 500 platforms.
| Parameter | Specification |
|---|---|
| Model | 1746-OB16 |
| Brand | Allen-Bradley |
| Origin | USA |
| Weight | 0.60 lbs (0.25 kg) |
| Dimensions | 145 x 35 x 130 mm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 280 mA @ 5 VDC, 0 mA @ 24 VDC backplane current load |
| Number of Outputs | 16 outputs (1 group) |
| Configuration | Sourcing configuration |
| Nominal Voltage | 24 VDC |
| Operating Voltage Range | 10 to 50 VDC |
| Max Output Current | 1 A per channel (16 A max per module) |
| Min Load Current | 1 mA |
| Max On-State Voltage Drop | 1.2 V @ 0.5 A |
| Max Off-State Leakage | 1 mA |
| Surge Current per Output | 3 A for 10 ms |
| Signal Delay (Resistive Load) | 0.1 ms (on) / 1 ms (off) |
| Heat Dissipation | 1.4 W min, 7.6 W total module max (0.388 W per point) |
| Isolation Voltage | 1500 V AC for 1 second (channel-to-backplane) |
| Indicating Style | Individual channel status LEDs |
| Terminal Style | Removable screw terminal block |
| Mounting Style | Rack mount (SLC 500 chassis slot) |
The 1746-OB16 manages discrete signal propagation matched to the backplane bus communication velocity constraints of the SLC chassis assembly. Integrated directly into the parallel hardware backplane, the module facilitates uniform I/O density scaling routines across legacy and updated Profinet / EtherNet/IP deterministic networks via network scanners. System consistency requires matching firmware flash compatibility across active network interface modules to accurately process the 16-point sourcing output map without generating cyclic communication packet errors or transmission delays.
Q: Does the 1746-OB16 support hot-swap (Removal and Insertion Under Power) capabilities?
A: No. The SLC 500 chassis backplane architecture does not support RIUP. The chassis power supply must be switched off completely before inserting or removing the module to prevent electrical damage to the internal logic components or backplane bus lines.
Q: What are the consequences of exceeding the 7.6 W total module heat dissipation threshold?
A: Exceeding the specified heat dissipation capacity can elevate local ambient operating temperatures inside the chassis enclosure, degrading the solid-state switching components, reducing output load accuracy, and potentially triggering early thermal shutdown states.
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