100% Genuine. 100,000+ Parts in Stock. Ready to Ship.

  • en

Allen-Bradley 1746-OB16 SLC 500 I/O Modules

The Allen-Bradley 1746-OB16/D, also cataloged as the 1746-OB16 Output Module, operates as a dedicated hardware component for discrete current-sourcing execution within SLC 500 platforms.

Hardware Specifications

Parameter Specification
Model 1746-OB16
Brand Allen-Bradley
Origin USA
Weight 0.60 lbs (0.25 kg)
Dimensions 145 x 35 x 130 mm
Operating Temp 0 to 60 deg C
Power Consumption 280 mA @ 5 VDC, 0 mA @ 24 VDC backplane current load
Number of Outputs 16 outputs (1 group)
Configuration Sourcing configuration
Nominal Voltage 24 VDC
Operating Voltage Range 10 to 50 VDC
Max Output Current 1 A per channel (16 A max per module)
Min Load Current 1 mA
Max On-State Voltage Drop 1.2 V @ 0.5 A
Max Off-State Leakage 1 mA
Surge Current per Output 3 A for 10 ms
Signal Delay (Resistive Load) 0.1 ms (on) / 1 ms (off)
Heat Dissipation 1.4 W min, 7.6 W total module max (0.388 W per point)
Isolation Voltage 1500 V AC for 1 second (channel-to-backplane)
Indicating Style Individual channel status LEDs
Terminal Style Removable screw terminal block
Mounting Style Rack mount (SLC 500 chassis slot)

Industrial Control & Drive Integration

The 1746-OB16 manages discrete signal propagation matched to the backplane bus communication velocity constraints of the SLC chassis assembly. Integrated directly into the parallel hardware backplane, the module facilitates uniform I/O density scaling routines across legacy and updated Profinet / EtherNet/IP deterministic networks via network scanners. System consistency requires matching firmware flash compatibility across active network interface modules to accurately process the 16-point sourcing output map without generating cyclic communication packet errors or transmission delays.

Frequently Asked Questions

Q: Does the 1746-OB16 support hot-swap (Removal and Insertion Under Power) capabilities?

A: No. The SLC 500 chassis backplane architecture does not support RIUP. The chassis power supply must be switched off completely before inserting or removing the module to prevent electrical damage to the internal logic components or backplane bus lines.

Q: What are the consequences of exceeding the 7.6 W total module heat dissipation threshold?

A: Exceeding the specified heat dissipation capacity can elevate local ambient operating temperatures inside the chassis enclosure, degrading the solid-state switching components, reducing output load accuracy, and potentially triggering early thermal shutdown states.

Field Installation Guidelines

  • Chassis Slot Insertion: Align the module circuit board with the upper and lower chassis guides of the selected slot. Slide the hardware firmly into the backplane connector until the top and bottom retaining tabs click and lock completely into place.
  • Terminal Wiring Setup: Ensure the removable terminal block is detached before inserting field wiring. Land the 24 VDC nominal sourcing power supply and field actuator loads onto the designated screw terminals, applying appropriate torque to avoid high-resistance contact points.
  • Shield Grounding Best Practices: Wire the SLC 500 chassis ground terminal directly to a low-impedance functional earth ground bus bar. Route all inductive load wiring, such as solenoid and relay coil lines, away from low-voltage communication paths to suppress high-frequency noise injection.

What's clients say about us

Translation missing: en.general.search.loading