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Allen-Bradley 1746-OBP16 SLC 500 I/O Modules

The Allen-Bradley 1746-OBP16, also cataloged as the 1746-OBP16 Output Module, serves as the primary 1746-OBP16 Product Type utilized to execute discrete current-sourcing tasks across SLC 500 platforms.

Hardware Specifications

Parameter Specification
Model 1746-OBP16
Brand Allen-Bradley
Origin USA
Weight 0.25 kg (Shipping Weight 2 kg)
Dimensions 145 x 35 x 130 mm
Operating Temp 0 to 60 deg C
Power Consumption Backplane current: 0.250 A @ 5 VDC, 0.0 A @ 24 VDC
Output Channels 16 sourcing outputs
Points per Common 16
Operating Voltage Range 20.4 to 26.4 VDC (source)
Continuous Current per Point 1.5 A @ 30 deg C, 1.0 A @ 60 deg C
Continuous Current per Module 6.4 A @ 0 to 60 deg C
Max On-State Voltage Drop 1.0 V @ 1.0 A
Surge Current per Point 4.0 A for 10 ms
Surge Current per Module 32.0 A for 10 ms
Off-State Leakage 1 mA max
Min Load Current 1 mA
Signal Delay (Resistive Load) On = 0.1 ms, Off = 1.0 ms
Isolation Voltage 1500 V AC for 1 second (channel-to-backplane)
Electronic Protection None
Mounting Style Installed in SLC 500 chassis

Industrial Control & Drive Integration

The 1746-OBP16 coordinates discrete switching operations matching the backplane bus communication velocity properties of the legacy chassis. To support extensive localized I/O density scaling routines, the hardware interfaces directly with central processing units via parallel chassis backplanes or remote scanners across Profinet / EtherNet/IP deterministic networks. Maintaining exact firmware flash compatibility across network infrastructure modules is necessary to manage the 16-point sourcing bit-map without inducing signal propagation latencies or cyclic data packet timeouts.

Frequently Asked Questions

Q: Does the 1746-OBP16 feature active short-circuit or thermal electronic protection?

A: No. The internal circuitry specifies no built-in electronic protection loops. External fast-acting fuses or current-limiting devices must be implemented on each sourcing output channel to protect the solid-state components from short-circuit faults and overcurrent conditions.

Q: Can the 1746-OBP16 be hot-swapped while the SLC 500 chassis backplane power is active?

A: No. The SLC 500 architecture lacks Removal and Insertion Under Power (RIUP) capability. The chassis power supply must be completely isolated and de-energized prior to inserting or removing the module to prevent physical degradation of the backplane connectors and logic chips.

Field Installation Guidelines

  • Module Insertion Execution: Power down the rack system. Align the circuit board edges with the top and bottom chassis slot channels, pushing the hardware inward until the mechanical retention clips latch securely to the chassis frame.
  • Field Wiring Terminations: Route field wiring through the removable terminal block interface. Land the 24 VDC nominal sourcing power line and individual load conductors, ensuring proper terminal screw torque to minimize contact resistance and local heat buildup.
  • Shield Grounding Protocols: Connect the SLC 500 chassis ground terminal to the main functional earth ground bus bar via a low-impedance conductor. Route all high-current DC output lines away from low-voltage communication paths to eliminate high-frequency noise injection.

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