The GE Fanuc IC695CHS012, also cataloged as the IC695CHS012 Universal Backplane, operates as a dedicated hardware component for multi-bus signal routing and module power distribution within PACSystems RX3i control platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CHS012 |
| Brand | GE Fanuc / Emerson |
| Product Line | PACSystems RX3i |
| Product Type | Universal Backplane |
| Number of Slots | 12 Slots |
| Bus Architecture | Dual-Bus (PCI Bus & Serial Bus) |
| Module Compatibility | RX3i PCI, RX3i Serial, Series 90-30 I/O Modules |
| Power Supply Support | AC and DC Power Supplies |
| Max Current @ 3.3 VDC | 600 mA (1.98 W) |
| Max Current @ 5 VDC | 240 mA (1.20 W) |
| Total Heat Dissipation | 3.18 W |
| Hot Swap Capability | Supported for standard I/O modules (Excludes CPU) |
| Expansion Support | I/O expansion cables & remote backplane cables |
| Terminator Requirement | External terminating resistor for remote connections |
| Weight | 4.00 lbs (1.81 kg) |
| Operating Temperature | 0 to 60 deg C |
Backplane Bus Architecture and I/O Density Scaling
The IC695CHS012 utilizes a high-velocity dual-bus backplane architecture combining a PCI bus for high-speed RX3i modules and a serial bus for backward compatibility with Series 90-30 I/O components. This dual-structure permits dynamic scaling of I/O density across mixed-generation control topologies without requiring bus translation gateways. Expansion interface connectors allow direct interconnection with remote backplane racks using dedicated expansion cabling. Signal integrity over extended expansion distances requires a dedicated external terminating resistor attached to the final rack endpoint.
Frequently Asked Questions
Q: Can the CPU module be replaced while the backplane power remains active?
A: No. While standard PCI, serial, and Series 90-30 I/O modules support hot-swapping (hot module insertion and removal) during operational runtime, CPU modules must be powered off before removal to prevent backplane bus arbitration errors.
Q: What are the internal current load limits imposed by the backplane logic circuitry?
A: The backplane onboard logic draws a maximum current of 600 mA at 3.3 VDC (1.98 W) and 240 mA at 5 VDC (1.20 W). System designers must ensure combined I/O module consumption remains within power supply output thresholds.
Field Installation Guidelines
- Mount the backplane securely on a flat vertical panel or standard DIN rail structure, maintaining a minimum vertical clearance of 100 mm above and below the chassis for ambient thermal convection.
- Connect the backplane grounding terminal directly to the central panel earth ground point using copper conductor wire with a minimum gauge of 14 AWG (2.08 mm sq) to minimize EMI susceptibility.
- Ensure that remote backplane expansion cables are equipped with an external terminating resistor plugged into the end rack to prevent high-frequency bus signal reflections.
- Observe proper insertion alignment when seating 90-30 or RX3i modules into slots 1 through 12 to avoid physical pin deformation on the backplane connector header.
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