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Configured for high-density voltage processing in RX3i PACSystem platforms, the GE IC694ALG232 (IC694ALG232 Analog Voltage Input Module) provides direct physical/electrical execution. The module interfaces analog field signals through 16 single-ended or 8 differential input channels, applying a 16-bit analog-to-digital converter for high-resolution signal digitization across the backplane network.

Hardware Specifications

Parameter Specification
Model IC694ALG232
Brand GE Fanuc Emerson
Series RX3i PACSystem
Product Type Analog Voltage Input Modules
Number of Channels 16 single-ended or 8 differential
Resolution 16-bit A/D conversion
Power Consumption 112 mA at 5 VDC; 110 mA at 24 VDC
Status Indicators LED indicators
Operating Temp 0 to 60 deg C
Storage Temp -40 to 85 deg C
Relative Humidity 5% to 95% (non-condensing)
Installation Altitude 1000 m
Dimensions Single-slot RX3i baseplate footprint
Weight 4.54 kg (10.00 lbs)
Origin USA

Backplane Bus Interfacing and Deterministic Networks

The IC694ALG232 interfaces with the RX3i system backplane to transfer digitized 16-bit input words directly to controller memory registers. The module leverages backplane bus communication velocity to maintain real-time throughput across all active single-ended or differential channel groupings. Integrated firmware flash compatibility ensures synchronized operational timing and consistent scan execution when scaling I/O density across multi-rack RX3i expansion architectures.

Frequently Asked Questions

Q: What power rails are required to operate the IC694ALG232 module?

A: The module draws 112 mA from the internal 5 VDC backplane supply and 110 mA from the 24 VDC system power rail.

Q: How can the channel architecture of the module be wired?

A: The hardware supports software-configurable physical field wiring for either 16 single-ended input channels or 8 differential input channels.

Q: What environmental temperature range is supported during active operations?

A: The module is rated for continuous operation within ambient temperatures ranging from 0 to 60 deg C.

Field Installation Guidelines

  1. De-energize system rack power and external 24 VDC field supplies prior to inserting or removing the module from the baseplate slot.
  2. Attach an ESD grounding wrist strap to an unpainted earth-grounded metal surface on the enclosure enclosure before handling the unit.
  3. Align the card housing with the RX3i baseplate slot guide rails and push firmly until the rear backplane connector fully seats.
  4. Wire field input leads according to single-ended or differential channel terminal diagrams, landing cable shield drain wires at a single enclosure ground point.
  5. Apply power and verify that the front-panel LED indicators show normal operational status without fault indications.

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