1769-IQ6XOW4 Allen-Bradley Digital Combo Module

1769-IQ6XOW4 Allen-Bradley Digital Combo Module | New Original Stock

Availability: 99 left in stock

Allen-Bradley 1769-IQ6XOW4 CompactLogix 6-In/4-Out Combo Module The Allen-Bradley 1769-IQ6XOW4, also cataloged as the 1769-IQ6XOW4 Digital Combination Module, operates as a...

SKU: 1769-IQ6XOW4

Manufacturer: Allen Bradley
Product No.: 1769-IQ6XOW4
Product Type: Digital I/O Cards
Product Origin: USA
Payment:T/T, Western Union
Weight: 280g
Shipping port: Xiamen
Warranty: 12 months

Description Reviews

Allen-Bradley 1769-IQ6XOW4 CompactLogix 6-In/4-Out Combo Module

The Allen-Bradley 1769-IQ6XOW4, also cataloged as the 1769-IQ6XOW4 Digital Combination Module, operates as a dedicated hardware component for discrete signal processing within CompactLogix and MicroLogix 1500 system platforms. The hardware processes 6 channels of unipolar or bipolar 24 VDC digital input variables while simultaneously driving 4 channels of independent AC/DC electromechanical relay output circuits. Physical interfacing is achieved through a single-slot footprint via a backplane connection layout.

Hardware Specifications

Parameter	Specification
Model	1769-IQ6XOW4
Brand	Allen-Bradley
Origin	United States
Weight	0.28 kg
Dimensions	118 x 35 x 87 mm
Operating Temp	0 to 60 deg C
Power Consumption	2.8 W maximum
Digital Inputs	6 points (sink/source, 10 to 30 VDC)
Relay Outputs	4 points (normally open, Form A)
Output Voltage Range	5 to 265 VAC / 5 to 125 VDC
Continuous Output Current	2.0 A maximum per point / 8.0 A maximum per module
Minimum Load Current	10 mA at 5 VDC
Response Time	Input: 8 ms typical / Output: 10 ms maximum
Backplane Current Draw	105 mA at 5.1 VDC / 45 mA at 24 VDC
Power Supply Distance Rating	8 modules maximum
Isolation Voltage	2650 VDC for 1 second (group-to-bus)

I/O Density Scaling and Deterministic Subsystems

The device infrastructure utilizes specialized software matrices to maintain consistent I/O density scaling profiles when integrated into remote expansion racks. Channel-to-bus communications interface directly with Profinet or EtherNet/IP deterministic networks, synchronizing the 8 ms input filtration delay and 10 ms relay coil actuation transitions with processor execution tasks. All data packets match explicit firmware flash compatibility constraints, suppressing bus jitter and preventing signal degradation during high-density cyclic processing intervals.

Frequently Asked Questions

Q: Does the local backplane assembly permit online module insertion and removal (RIUP) while energized?

A: No. The 1769 backplane architecture does not support live hardware swaps. Power generation feeding the local rack partition must be fully isolated before mounting or removing the module to avoid circuit breakdown or unintended CPU fault conditions.

Q: How are the discrete input points configured to accept both NPN and PNP field sensor types?

A: The input channels feature a bipolar electrical circuit layout. Grouped return reference paths allow the module to accept either +24 VDC sourcing (PNP) or 0 VDC sinking (NPN) sensor topologies based on the electrical potential applied to the input return terminal.

Q: What are the installation boundary restrictions regarding position relative to the system power supply module?

A: This combination card has a power supply distance rating of 8. The unit must be positioned within 8 available module slots of an active 1769 chassis power supply card to sustain nominal internal bus voltage.

Field Installation Guidelines

Isolate all primary and secondary power sources supplying the 1769 system rail before executing physical installation procedures.
Wire the discrete input and relay output conductors to the 1769-RTBN18 removable terminal block assembly before latching the block onto the module chassis.
Route all high-voltage AC load lines leading to the relay contacts in separate wire trays away from low-voltage DC sensor lines and network cables.
Install external surge suppression hardware, such as RC snubbers for AC inductive loads or flyback diodes for DC inductive loads, across field elements to prevent contact degradation.
Secure all adjacent module locking latches completely to establish continuous electrical ground bonding across the local assembly rail.

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