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Allen-Bradley 1769-OW16 CompactLogix Relay Output Module

Configured for digital electromechanical circuit switching in CompactLogix and MicroLogix 1500 architectures, the Allen-Bradley 1769-OW16 (1769-OW16 Digital Relay Output Module) provides direct physical/electrical execution. This expansion component utilizes 16 independent normally open (N.O.) physical contacts arranged in isolated circuit groups to command disparate alternating current (AC) and direct current (DC) loads without solid-state leakage characteristics.

Hardware Specifications

Parameter Specification
Model 1769-OW16
Brand Allen-Bradley / Rockwell Automation
Origin USA
Weight 0.45 kg (1.0 lb)
Dimensions 118 x 52.5 x 87 mm (H x W x D)
Operating Temp 0 to 60 deg C
Power Consumption 4.75 W maximum
Output Points 16 Normally Open (N.O.) contacts
Isolation Groups 2 isolated groups (8 points per group)
Operating Voltage Range 5-265 VAC / 5-125 VDC
Backplane Current Draw 205 mA @ 5.1 VDC / 180 mA @ 24 VDC
Max Current per Point 2.5 A
Max Current per Module 20.0 A
AC Contact Rating 1800 VA Make / 180 VA Break @ 120V/240 VAC
DC Contact Rating 28 VA (0.22 A @ 125 VDC; 1.0 A @ 28 VDC)
Signal Delay 10 ms maximum (On and Off states)
Power Supply Distance 8 modules maximum distance rating

Real-Time Bus Interaction and I/O Density Scaling

The internal logic card coordinates output register tracking with the backplane bus communication velocity across the centralized processing link. Firmware flash compatibility enforces predictable interface mapping when the master controller maps the 16-point allocation into the data table structure. By eliminating solid-state leakage currents, this electromechanical design maintains exact true/false status verification within automated I/O density scaling routines, enabling simultaneous multi-phase circuit handling over distinct isolated voltage potentials.

Frequently Asked Questions

Q: What are the specific installation distance limits regarding backplane power distribution for this module? A: The module exhibits a hardware power supply distance rating of 8 slots. It must be physically positioned within 8 module slots of the system power supply to prevent bus voltage degradation along the logic power rails.

Q: Can this relay output module be hot-swapped while the main system chassis is actively running? A: No. The local 1769 backplane architecture does not support Removal and Insertion Under Power (RIUP). Operating personnel must isolate all backplane supply voltages and external field circuit potentials before installing or removing the hardware to prevent damage to the gold-plated bus connectors.

Q: How does the internal isolation boundary function between the separate output channels? A: The 16 points are divided into two distinct galvanic isolation groups of 8 points each. This allows Group 1 to switch 120 VAC control lines while Group 2 simultaneously manages isolated 24 VDC pilot circuits inside the same physical assembly.

Field Installation Guidelines

Mount the module assembly vertically or horizontally onto an approved DIN-rail configuration inside a sealed industrial enclosure. Maintain an uninhibited clearance parameter of 50 mm around all ventilation openings to accommodate proper thermal convective patterns and stay within the 0 to 60 deg C operating range.

Field wiring terminations must utilize the standard 22-14 AWG solid or 22-16 AWG stranded copper conductors connected to the designated termination interface. Route all high-voltage AC inductive load conductors through independent wiring pathways separated from low-voltage digital and analog signal cables. To maximize the operational life expectancy of the physical contacts when driving inductive devices (such as solenoids or contactors), install external surge suppression circuits consisting of RC snubbers for AC circuits or commutating diodes for DC circuits across the field load.

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