The GE Fanuc IC693BEM330, also cataloged as the IC693BEM330 FIP I/O Scanner, operates as a dedicated hardware component for distributed I/O data processing within Series 90-30 and Series 90-70 platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC693BEM330 |
| Brand | GE Fanuc Emerson |
| Origin | United States |
| Weight | 0.69 lbs (0.31 kg) |
| Dimensions | Single-slot Form Factor |
| Operating Temp | Standard Industrial Limits (Refer to Manual) |
| Power Consumption | 609 mA at 5 VDC |
| Module Type | FIP I/O Scanner |
| Communication Ports | Two (2) 9-pin D-shell female connectors; One (1) Synchro port |
| Transmission Rate | 1 MHz |
| Backplane Support | Universal Backplane |
| Maximum I/O Capacity | Up to 19 I/O modules (across 2 baseplates) |
| Protocol Support | FIP and WORLD FIP |
| Synchro Mating Connector | Molex #39-01-4031 |
| Status LED Indicators | CD1, TEN1, CD2, TEN2 |
Deterministic Inter-Backplane Scaling and Signal Profiles
The module leverages a 1 MHz network transmission rate to establish deterministic I/O density scaling across remote drops. High-velocity serialization logic updates and maps remote I/O variables into the primary CPU application memory space during defined scan windows. To eliminate data jitter during high-density block transfers, the integrated synchronization loop matches the communication velocity profile directly to the system backplane clock.
Frequently Asked Questions
Q: What are the specific slot limitations for the IC693BEM330 inside the main baseplate?
A: The module must be positioned exclusively in slot 1 of the CPU baseplate. Insertion into standard I/O slots or expansion baseplate slots will prevent proper backplane bus communication velocity and initialization.
Q: What physical interfaces are required for establishing the FIP network link and synchronization?
A: The primary FIP network utilizes the two front-facing 9-pin D-shell female connectors. For network synchronization across remote drops, the dedicated Synchro port requires a mating Molex connector catalog number #39-01-4031.
Field Installation Guidelines
- Chassis Attachment: Ensure the module is properly aligned with the top and bottom chassis guides of slot 1 before pivoting the unit down into the backplane connector. Fasten the structural screw to secure grounding.
- Cable Routing Constraints: Route the FIP network cables away from high-voltage AC lines and motor drive paths to avoid industrial electrical noise from disrupting the 1 MHz differential carrier signal.
- Shield Grounding: All FIP network cable shields must be grounded at defined points according to standard industrial field bus installation practices to prevent carrier detection errors on channels 1 and 2.
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