The GE Fanuc IC695ALG508, also cataloged as the IC695ALG508 RTD Input Module, operates as a dedicated hardware component for temperature sensor signal conditioning and digitizing within PACSystem RX3i platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695ALG508 |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.26 kg (0.56 lbs) |
| Dimensions | Standard RX3i single-slot module |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 400 mA at 3.3 VDC, 200 mA at 5.1 VDC (2.5 W max power dissipation) |
| Number of Channels | 8 differential channels (isolated) |
| RTD Input Types | Platinum (385/391.6), Nickel (618/672), Copper (426), Nickel-Iron (518) |
| RTD Wiring | 2, 3, or 4 wire RTD configurations |
| Resistance Input Ranges | 0-260, 0-525, 0-1050, 0-2100, 0-3150, 0-4200 ohms |
| Measurement Units | deg C, deg F, or Ohms |
| Data Format | 16-bit integer (in 32-bit field) or 32-bit real number |
| Configurable Filters | Notch filter selection from 2.3 Hz to 28 Hz |
| Hot-Swap Support | Removal and Insertion Under Power (RIUP) enabled |
Backplane Bus Communication Velocity & I/O Density Scaling
The IC695ALG508 communicates over the PCI-based RX3i backplane bus, transferring digitized temperature data to the central processor with optimized bus communication velocity. High I/O density scaling allows eight isolated differential channels to interface independently with 2-, 3-, or 4-wire RTD sensors and direct resistance sources. Dedicated firmware flash compatibility maintains continuous module diagnostics—including RAM, Flash, and hardware watchdog verification—to prevent false signal updates during system operation.
Frequently Asked Questions
Q: Does the IC695ALG508 support Removal and Insertion Under Power (RIUP)?
A: Yes, the module supports hot-swap operation (RIUP), allowing replacement under active system power without interrupting other modules on the backplane.
Q: What power rails are utilized by the module from the RX3i backplane?
A: The module draws 400 mA from the 3.3 VDC backplane supply rail and 200 mA from the 5.1 VDC backplane supply rail, consuming a maximum power dissipation of 2.5 W.
Q: What RTD wiring configurations are natively supported on each channel?
A: Each of the 8 differential channels can be individually configured for 2-wire, 3-wire, or 4-wire RTD wiring setups via hardware configuration in software.
Field Installation Guidelines
- Align the module card guide with the chosen baseplate slot and insert until the top and bottom locking hooks latch into place.
- If performing a hot-swap (RIUP), ensure the field wiring connector is detached prior to releasing the module lock levers from the backplane.
- Terminate RTD field cables using shielded twisted pair conductors, connecting shields directly to the cabinet ground bar to prevent noise pickup.
- Verify that lead resistance on 3-wire and 4-wire RTD runs is balanced across terminals to maintain specified measurement accuracy.
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