Configured for signal distribution and field device interfacing in CENTUM VP distributed control systems, the Yokogawa SARM55C (SARM55C Terminal Board) provides direct physical signal routing for digital output operations.
| Parameter | Specification |
|---|---|
| Model | SARM55C |
| Brand | Yokogawa |
| Origin | Indonesia |
| Weight | 2.2 kg |
| Dimensions | 482.6 mm (W) x 132.5 mm (H) (3U) |
| Operating Temp | 0 to 50 deg C |
| Power Consumption | Max. 0.65 A (24 V DC) |
| Relay Points | 32-point output |
| Insulation Resistance | At least 10 MΩ (500 V DC) |
| Withstanding Voltage | 2 kV (Field to Case/Power); 500 V (24 V Power to Case) |
The SARM55C serves as a mechanical relay interface, facilitating the transition between the Yokogawa FIO subsystem digital output modules and field-level actuators. To maintain signal integrity and ensure loop stability, the board utilizes dry contact switching. This architecture requires adherence to specific loop protocol constraints, particularly regarding inductive load suppression. When integrating with controllers such as the ADV551 or ADV561, engineers must account for the mechanical switching latency inherent in relay-based designs. Furthermore, the board provides galvanic isolation between the field device terminals and the internal 24 VDC control power rail, protecting the backplane from field-side transients.
Q: Can the SARM55C be used for high-frequency pulse output applications?
A: No. The SARM55C utilizes mechanical relays which are subject to physical contact bounce and wear. High-frequency switching will significantly degrade the relay lifespan. Solid-state alternatives are recommended for high-speed pulse applications.
Q: Is the terminal board compatible with both single and redundant DO module configurations?
A: Yes. The board supports both single and dual-redundant module topologies, provided the correct interface cables (e.g., AKB331 or AKB337) are utilized to maintain signal mapping consistency.
Q: Does this board support hot-swapping?
A: The board itself is a passive terminal component. While the connected DO modules may support hot-swapping under specific system conditions, verify that all power to the associated field terminals is isolated before performing maintenance on the wiring.
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